Method of producing printed circuit layers and tool therefor
Abstract
Abstract The invention comprises essentially four phases: a) production of a reusable tool-plate P1 consisting, on its surface, of an electrically conductive material 1 partially covered with an insulating coating 5' adhering to this material and replicating the reverse pattern of the conductive depositions of the layer to be produced. b) electroplating the metallic parts of the tool-plate by means of a conductive material. c) transfer of the said conductive material onto an insulating support by pressing and heating. d) separation of the tool-plate from the insulating support in order to obtain the printed circuit layer provided with conductive depositions replicating the desired electrical pattern and to reconstitute the tool-plate P1 as produced in (a) with a view to a new cycle (b), (c), (d). <IMAGE>
Inventors
- 👤 Michel Delair
Bibliographic Details
Claims Analysis
Total Claims: 0References Cited (Backward Citations)
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