EP0059092A1
Expired / Lapsed
EP
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Printed circuit lead carrier tape
Assignee: Individual
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Filing: 1982-02-22
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Granted: —
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Expires: 2002-02-22
Abstract
Abstract Tape 20 has apertures 26 into each of which extend leads 22 for attachment to bonding pads 30 of integrated circuit 28. To strengthen the leads and hold them in position for bonding they are integral with a frame 32 within which is an integral pull tab 33. After bonding the tab 33 is pulled, breaking the frame at neck 34 and successively breaking links 35 which connect the frame to the leads. The leads are then cut away from the edge of the aperture 26 and bonded at 31 to further connectors.
Inventors
- 👤 Thomas Louis Angelucci
- 👤 Joseph Louis Angelucci
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-09 13:45
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/40; H10W70/453; H10W72/00; H10W72/071; H10W72/077; H10W72/701; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913; Y10T29/49139; Y10T29/4914; Y10T29/49142
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
102 words
A lead carrier tape for attachment of leads to semiconductor devices comprising a base tape of flexible dielectric -material and a pattern of flexible conductive foil on the tape, the pattern including leads extending in a common plane from the tape over the edge of an aperture in the tape for attachment to terminals of a semiconductor device wherein the foil pattern also includes a frame connecting together the ends of the leads within the aperture, the links between the frame and the leads being weakened such that the frame can be torn away after attachment of the leads to the terminals.
Claim 2
Dependent Claim
102 words
A lead carrier tape for attachment of leads to semiconductor devices comprising a base tape of flexible dielectric -material and a pattern of flexible conductive foil on the tape, the pattern including leads extending in a common plane from the tape over the edge of an aperture in the tape for attachment to terminals of a semiconductor device wherein the foil pattern also includes a frame connecting together the ends of the leads within the aperture, the links between the frame and the leads being weakened such that the frame can be torn away after attachment of the leads to the terminals.
Claim 3
Dependent Claim
33 words
A lead carrier tape as claimed in claim 1 wherein the foil pattern further includes a pull tab disposed within the frame and connected to the frame at one position around the frame.
Claim 4
Dependent Claim
48 words
A lead carrier tape as claimed in claim 2 in which the frame has a weakened zone close to the position at which the pull tab is connected whereby upon pulling the pull tab the frame is broken and thereafter the links with the leads are broken successively.
Claim 5
Dependent Claim
35 words
A lead carrier tape as claimed in any of the preceding claims in which the frame is provided with expansion joints to allow stretching of the frame during attachment of the leads to the terminals.
Claim 6
Dependent Claim
42 words
A lead carrier tape as claimed in any of claims 1 to 3 in which the frame is rectangular and has at each corner a bight which allows displacement of one side of the frame without substantial deflection of the adjacent sides.
Claim 7
Independent Claim
110 words
A method of attaching leads to a semiconductor deyice using a lead carrier tape which comprises a base tape of flexible dielectric material and a pattern of flexible conductive foil on the tape, the pattern including leads extending in a common plane from the tape over the edge of an aperture in the tape for attachment to terminals of the device wherein the foil pattern also includes a frame connecting together the ends of the leads within the aperture, and in which after attachment of the leads to the terminals the frame is removed by pulling on the frame and thereby tearing the links between the frame and the leads.
Claim 8
Independent Claim
110 words
A method of attaching leads to a semiconductor deyice using a lead carrier tape which comprises a base tape of flexible dielectric material and a pattern of flexible conductive foil on the tape, the pattern including leads extending in a common plane from the tape over the edge of an aperture in the tape for attachment to terminals of the device wherein the foil pattern also includes a frame connecting together the ends of the leads within the aperture, and in which after attachment of the leads to the terminals the frame is removed by pulling on the frame and thereby tearing the links between the frame and the leads.
Claim 9
Independent Claim
61 words
A method as claimed in claim ' 6 in which the foil pattern also includes a pull tab disposed within the frame and connected to the frame at one position around the frame and the removal of the frame is effected by pulling on the tab to break the frame and thereafter tear the links between the frame and the leads.
References Cited (Backward Citations)
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