EP0061536B1
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Method of manufacturing a semiconductor device having improved alignment marks and alignment marks for said method
Assignee: Fujitsu Ltd
•
Filing: 1981-12-17
•
Granted: 1985-04-24
•
Expires: 2001-12-17
Abstract
No abstract record available.
Inventors
- 👤 Shuzo Fujimura
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-02 19:10
CPC Classifications
G; G03; G03F; G03F9/00; G03F9/70; G03F9/7073; G03F9/7084; H; H10; H10P; H10P95/00; H10W; H10W46/00; H10W46/101; H10W46/501
Claims Analysis
Total Claims: 6
Claim 1
Independent Claim
234 words
Method of manufacturing a semiconductor device comprising the process of successively superimposing and printing on a semiconductor substrate a plurality of patterns including respective alignment marks, characterized by the steps of: (a) printing and forming on the semiconductor substrate a first pattern which includes a first alignment mark, (b) in forming a second pattern on the substrate, positioning and printing a second alignment mark which has a shape different from that of the first alignment mark and which is included in a second pattern, said second alignment mark being positioned relative to the first alignment mark on the substrate, in such a manner that a part of the periphery of each alignment mark intersects with a part of the periphery of the other alignment mark and at least one part of the periphery of the first alignment mark is opposed to that of the second alignment mark with a minute distance separation from each other, and (c) in forming a third pattern on the substrate, positioning and printing a third alignment mark included in a third pattern in such a manner that one part of the periphery of the third alignment mark is opposed to one part of the periphery of the first alignment mark, and at least one part of another portion of the periphery of the third alignment mark is opposed to one part of the periphery of the second alignment mark.
Claim 2
Dependent Claim
234 words
Method of manufacturing a semiconductor device comprising the process of successively superimposing and printing on a semiconductor substrate a plurality of patterns including respective alignment marks, characterized by the steps of: (a) printing and forming on the semiconductor substrate a first pattern which includes a first alignment mark, (b) in forming a second pattern on the substrate, positioning and printing a second alignment mark which has a shape different from that of the first alignment mark and which is included in a second pattern, said second alignment mark being positioned relative to the first alignment mark on the substrate, in such a manner that a part of the periphery of each alignment mark intersects with a part of the periphery of the other alignment mark and at least one part of the periphery of the first alignment mark is opposed to that of the second alignment mark with a minute distance separation from each other, and (c) in forming a third pattern on the substrate, positioning and printing a third alignment mark included in a third pattern in such a manner that one part of the periphery of the third alignment mark is opposed to one part of the periphery of the first alignment mark, and at least one part of another portion of the periphery of the third alignment mark is opposed to one part of the periphery of the second alignment mark.
Claim 3
Dependent Claim
210 words
Method of manufacturing a semiconductor device comprising the process of successively superimposing and printing on a semiconductor substrate a plurality of patterns including respective alignment marks, characterized by the steps of: (a) transferring on the substrate a mask pattern including a first alignment mark of a first photomask, (b) in the transfer of a mask pattern of a second photomask onto the substrate, positioning and then transferring a second alignment mark provided on the second photomask, said second alignment mark having a shape which is different from that of the first alignment mark and being positioned relative to the first alignment mark on the substrate, in such a manner that the periphery of each mark intersects with each other, and at least one part thereof is opposed to each other, and (c) in the transfer of a mask pattern of a third photomask, positioning and then printing a third alignment mark provided on the third mask in such a manner that one part of the periphery thereof is opposed to one part of the periphery of the first alignment mark, and at least one part of another portion of the periphery of the third mark is opposed to at least one part of the periphery of the second alignment mark.
Claim 4
Dependent Claim
210 words
Method of manufacturing a semiconductor device comprising the process of successively superimposing and printing on a semiconductor substrate a plurality of patterns including respective alignment marks, characterized by the steps of: (a) transferring on the substrate a mask pattern including a first alignment mark of a first photomask, (b) in the transfer of a mask pattern of a second photomask onto the substrate, positioning and then transferring a second alignment mark provided on the second photomask, said second alignment mark having a shape which is different from that of the first alignment mark and being positioned relative to the first alignment mark on the substrate, in such a manner that the periphery of each mark intersects with each other, and at least one part thereof is opposed to each other, and (c) in the transfer of a mask pattern of a third photomask, positioning and then printing a third alignment mark provided on the third mask in such a manner that one part of the periphery thereof is opposed to one part of the periphery of the first alignment mark, and at least one part of another portion of the periphery of the third mark is opposed to at least one part of the periphery of the second alignment mark.
Claim 5
Dependent Claim
130 words
Alignment marks for positioning masks comprising first, second and third alignment marks included in respective first, second and third masks, each alignment mark having a closed loop contour, characterized in that the shapes of the first and second alignment marks are different in such a way that, when superimposing the masks, the contours of the first and second alignment marks intersect with each other, at least one part of the contours thereof is opposed to each other, one part of the contour of the third alignment mark is opposed to one part of the contour of the first alignment mark, and at least one part of another portion of the contour of the third mask is opposed to at least one part of the contour of the second alignment mark.
Claim 6
Dependent Claim
130 words
Alignment marks for positioning masks comprising first, second and third alignment marks included in respective first, second and third masks, each alignment mark having a closed loop contour, characterized in that the shapes of the first and second alignment marks are different in such a way that, when superimposing the masks, the contours of the first and second alignment marks intersect with each other, at least one part of the contours thereof is opposed to each other, one part of the contour of the third alignment mark is opposed to one part of the contour of the first alignment mark, and at least one part of another portion of the contour of the third mask is opposed to at least one part of the contour of the second alignment mark.
References Cited (Backward Citations)
No citation records indexed.
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.