EP0068142A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Gas cooled modules for electrical components
Assignee: International Business Machines Corp
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Filing: 1982-05-24
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Granted: —
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Expires: 2002-05-24
Abstract
Abstract A heat dissipating system for cooling circuit chips or modules is described. The system includes circuit chips (30) which are vertically mounted, an inert gas (40) at an elevated pressure being contained within an encased module (20) for providing an enhanced thermal coupling between the chips contained therein, and the walls (22, 26) of the encased module, whereby heat removal from the chips or modules is increased. This enhanced thermal coupling is combined with a reduction in the temperature of the wall (22) of the encased modules so as to reduce the thermal resistance between the surrounding gas and the chips or modules to be cooled, whereby heat removal from the circuit chips or modules is substantially increased. The gas is maintained at a pressure above 240 kPa (35 psi), preferably above 480 kPa (70 psi). Helium is a suitable thermally conducting inert gas.
Inventors
- 👤 Arnold Reisman
- 👤 Melvin Berkenblit
- 👤 Charles Joseph Merz, Iii
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-04 01:55
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/30; H10W40/70
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
57 words
A gas encapsulated cooling module for heat generating electrical components, comprising a closed housing (20) having side walls (22, 26) one or more heat generating electrical components (30) mounted within the housing and an inert, thermally conductive gas (40) within the housing, said module being characterised in that the gas (40) is maintained at an elevated pressure.
Claim 2
Dependent Claim
57 words
A gas encapsulated cooling module for heat generating electrical components, comprising a closed housing (20) having side walls (22, 26) one or more heat generating electrical components (30) mounted within the housing and an inert, thermally conductive gas (40) within the housing, said module being characterised in that the gas (40) is maintained at an elevated pressure.
Claim 3
Dependent Claim
18 words
A module as claimed in claim 1, further characterised in that the gas pressure is above 240 kPa.
Claim 4
Dependent Claim
20 words
A module as claimed in claim 2, further characterised in that the gas pressure is above 480 k P a.
Claim 5
Dependent Claim
18 words
A module as claimed in claim 3, further characterised in that the gas pressure is above 14 MPa.
Claim 6
Dependent Claim
91 words
A module as claimed in claim 1, 2 or 3 in which means are provided to remove heat conducted by the gas from the components to the walls of the housing, characterised in that the heat removal means maintains the external surface of at least one wall of the housing below a predeter- .mined temperature, said temperature having been calculated to ensure that the gas does not rise above a temperature at which its thermal resistance would be too high to maintain the component at or below its designed operating temperature.
Claim 7
Dependent Claim
120 words
A gas encapsulated cooling module for heat generating electrical components, comprising a closed housing (20), one or more heat generating electrical components (30) mounted within the housing, and an inert, thermally conductive gas (40) within the housing, said module being characterised by comprising means for reducing the temperature of the walls of the housing so as to reduce the thermal resistance of the gas to a value at which the necessary quantity of heat can be conducted by the gas from the components to the walls of the housing in combination with maintaining the gas at an elevated pressure (above 240 kPa) to provide enhanced thermal coupling between the components and the gas and between the gas and the housing.
Claim 8
Dependent Claim
120 words
A gas encapsulated cooling module for heat generating electrical components, comprising a closed housing (20), one or more heat generating electrical components (30) mounted within the housing, and an inert, thermally conductive gas (40) within the housing, said module being characterised by comprising means for reducing the temperature of the walls of the housing so as to reduce the thermal resistance of the gas to a value at which the necessary quantity of heat can be conducted by the gas from the components to the walls of the housing in combination with maintaining the gas at an elevated pressure (above 240 kPa) to provide enhanced thermal coupling between the components and the gas and between the gas and the housing.
Claim 9
Dependent Claim
132 words
A gas encapsulated cooling module for heat generating electrical components, comprising a closed housing (20), one or more heat generating electrical components (30) mounted within the housing, an inert, thermally conducting gas (40) within the housing, and means for removing heat from the housing, said module being characterised in that the or each component is a large scale integrated component producing, in use, substantial quantities of heat in a very small volume, in that the gas is maintained at a pressure above 240 kPa, and in that the heat removing means are effective in operation to maintain a thermal gradient between the or each component and an exterior surface of the housing sufficiently high to ensure that the or each component are adequately cooled to their designed operating temperatures in normal operation.
Claim 10
Dependent Claim
132 words
A gas encapsulated cooling module for heat generating electrical components, comprising a closed housing (20), one or more heat generating electrical components (30) mounted within the housing, an inert, thermally conducting gas (40) within the housing, and means for removing heat from the housing, said module being characterised in that the or each component is a large scale integrated component producing, in use, substantial quantities of heat in a very small volume, in that the gas is maintained at a pressure above 240 kPa, and in that the heat removing means are effective in operation to maintain a thermal gradient between the or each component and an exterior surface of the housing sufficiently high to ensure that the or each component are adequately cooled to their designed operating temperatures in normal operation.
References Cited (Backward Citations)
No citation records indexed.
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