Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
78 words
A method of electrically interconnecting a plurality of varistor bodies formed predominantly of metal oxide, comprising the steps of: applying molten solder to receiving surfaces provided on opposite sides of each said varistor body, subjecting said applied molten solder to vibrations of from 5,000 to 35,000 hertz whereby the solder strongly adheres to the receiving surfaces, and soldering a plurality of said varistor bodies to one another along their respective receiving surfaces to electrically interconnect said varistor bodies.
Claim 2
Independent Claim
78 words
A method of electrically interconnecting a plurality of varistor bodies formed predominantly of metal oxide, comprising the steps of: applying molten solder to receiving surfaces provided on opposite sides of each said varistor body, subjecting said applied molten solder to vibrations of from 5,000 to 35,000 hertz whereby the solder strongly adheres to the receiving surfaces, and soldering a plurality of said varistor bodies to one another along their respective receiving surfaces to electrically interconnect said varistor bodies.
Claim 3
Dependent Claim
62 words
A method as in Claim 1 including the steps of allowing the solder to solidify after being subjected to vibrations of from 5,000 to 35,000 hertz to create a solder contact on each said receiving surface, and then soldering together the solder contacts of adjacent varistor bodies to accomplish the step of soldering a plurality of said varistor bodies to one another.
Claim 4
Dependent Claim
26 words
A method as in Claim 1 in which all said steps in the method of electrically interconnecting a plurality of varistor bodies are performed substantially simultaneously.
Claim 5
Dependent Claim
67 words
A method as in Claim 1 in which said varistor bodies each have a pair of receiving surfaces on opposite sides thereof and an intermediate surface area extending between said receiving surfaces, said method including a preliminary masking step in which said intermediate surface of each said varistor body is masked to prevent solder from adhering to said intermediate surface area during subsequent steps in said method.
Claim 6
Dependent Claim
58 words
A method as in Claim 4 in which said masking step includes coating said intermediate surface area of each of said varistor body with solder inhibitor means for preventing adherence of solder to said varistor body thereby producing a masked varistor body, subsequent steps in said method serving to electrically interconnect a plurality of said masked varistor bodies.
Claim 7
Dependent Claim
77 words
A method as in Claim 5 in which said step of soldering a plurality of said varistor bodies to one another includes immersing a plurality of said masked varistor bodies in a solder bath of molten solder, positioning said masked varistor bodies side-by-side with said receiving surfaces facing one another to form a column in said solder bath, and then removing said column of masked varistor bodies from said solder bath to permit solidification of the solder.
Claim 8
Dependent Claim
82 words
A method as in Claim 5 in which the steps following said masking step include immersing a plurality of said masked varistor bodies in a vibrating solder bath which vibrates molten solder contained therein at frequencies of from 5,000 to 35,000 hertz, positioning said masked varistor bodies side-by-side with said receiving surfaces facing one another, to form a column in said vibrating solder bath, and then removing said column of bodies from said vibrating solder bath to permit solidification of the solder.
Claim 9
Dependent Claim
60 words
A method as in Claim 5 in which said masking step further includes coating edge portions of each said receiving surface of said varistor bodies with solder inhibitor means for preventing adherence of solder to said varistor bodies such that said masked varistor bodies include surface areas which are unmasked only on a central portion of each said receiving surface.
Claim 10
Dependent Claim
40 words
9 . A method as in Claim 5 including the step of removing said solder inhibitor means from the electrically interconnected varistor bodies after said step of soldering a plurality of said varistor bodies to one another has been accomplished.
Claim 11
Independent Claim
158 words
A method of electrically interconnecting a plurality of varistor bodies formed predominantly of metal oxide in an end-to-end relationship with one another whereby to form a column, each of said varistor bodies including opposite end surfaces and a circumferential side surface extending therebetween, said method comprising the steps of: initially coating the entire circumferential side surface of each of said varistor body with a substance which prevents solder from adhering thereto; immersing said coated varistor bodies in a bath of molten solder; vibrating said solder bath so as to cause the molten solder therein to vibrate at frequencies of from 5,000 to 35,000 hertz; while said solder vibrates, maintaining said coated varistor bodies in end-to-end relationship with one another to form a column in the vibrating solder bath; and thereafter removing said stack of varistor bodies from said vibrating solder bath to permit solidification of the solder between the adjacent ends of each adjacent pair of varistor bodies.
Claim 12
Independent Claim
158 words
A method of electrically interconnecting a plurality of varistor bodies formed predominantly of metal oxide in an end-to-end relationship with one another whereby to form a column, each of said varistor bodies including opposite end surfaces and a circumferential side surface extending therebetween, said method comprising the steps of: initially coating the entire circumferential side surface of each of said varistor body with a substance which prevents solder from adhering thereto; immersing said coated varistor bodies in a bath of molten solder; vibrating said solder bath so as to cause the molten solder therein to vibrate at frequencies of from 5,000 to 35,000 hertz; while said solder vibrates, maintaining said coated varistor bodies in end-to-end relationship with one another to form a column in the vibrating solder bath; and thereafter removing said stack of varistor bodies from said vibrating solder bath to permit solidification of the solder between the adjacent ends of each adjacent pair of varistor bodies.