EP0080041A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Inter-connecting devices for electric circuits
Assignee: International Business Machines Corp
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Filing: 1982-09-22
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Granted: —
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Expires: 2002-09-22
Abstract
Abstract A semi-conductor package comprises an integrated semi-conductor chip or wafer (12) connected to the pins (46) of a pin connector block (14) through flat conductors (33) formed on a flexible insulating sheet (30'). The sheet (30') is of annular configuration and the wafer (12) overlays the central aperture and the inner margin of the sheet. Each conductor (33) is depressed through an aligned hole (34) and soldered to the appropriate contact pad (36) by solder fillet (38). The pins (46) are soldered to conductors (33) and plated through holes (41). A second sheet (30") forms a laminar structure with the sheet (30') and the conductors (33) and serves to protect the conductors. The central aperture is rectangular and the holes (34) are arranged in four groups, one along each side of the aperture, and each group comprises two rows of holes, the holes in the two rows being staggered. Connections are made to four connector blocks, again one along each side of the aperture. Each connector comprises four rows of connecting pins.
Inventors
- 👤 Bill Frank Huckabee
- 👤 William Leon Wright
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-28 10:26
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/67; H10W70/688; H05; H05K; H05K3/00; H05K3/36; H05K3/361; H05K3/363; H10W70/611; H10W70/62; H10W70/63; H10W70/635; H10W72/00; H10W72/701; H05K2201/00; H05K2201/10; H05K2201/10227; H05K2201/10295; H05K2201/10303; H05K2201/10613; H05K2201/10621; H05K2201/10681; H05K3/30; H05K3/32; H05K3/34; H05K3/3447
Claims Analysis
Total Claims: 11
Claim 1
Independent Claim
172 words
The device for individually inter-connecting contact pads formed on a semiconductor wafer or substrate and connected to circuitry on the wafer or substrate and connecting pins to which external electrical connections can be made, said device (30) comprising an insulating sheet (30') having a multiplicity of electrically separate conductors (33) formed thereon, each conductor (33) extending from an associated one of a multiplicity of holes (41) formed through the sheet (30') and arranged in a pattern matching the locations of the pins (46) to a multiplicity of pad positions (36') arranged in a pattern matching the locations of the pads (36) on the wafer or substrate (12), characterised in that a second multiplicity of holes (34) are formed through the sheet (30'), said second holes (34) being located at the pad positions (36') and each being of a size to encompass a pad (36), and in that the conductors (33) respectively extend across the second holes (34) and thereby form individual compliant mountings for the pads (36) of the wafer or substrate.
Claim 2
Independent Claim
172 words
The device for individually inter-connecting contact pads formed on a semiconductor wafer or substrate and connected to circuitry on the wafer or substrate and connecting pins to which external electrical connections can be made, said device (30) comprising an insulating sheet (30') having a multiplicity of electrically separate conductors (33) formed thereon, each conductor (33) extending from an associated one of a multiplicity of holes (41) formed through the sheet (30') and arranged in a pattern matching the locations of the pins (46) to a multiplicity of pad positions (36') arranged in a pattern matching the locations of the pads (36) on the wafer or substrate (12), characterised in that a second multiplicity of holes (34) are formed through the sheet (30'), said second holes (34) being located at the pad positions (36') and each being of a size to encompass a pad (36), and in that the conductors (33) respectively extend across the second holes (34) and thereby form individual compliant mountings for the pads (36) of the wafer or substrate.
Claim 3
Dependent Claim
60 words
A device as claimed in claim 1, further characterised in that the sheet (30') has an aperture (35) therethrough of similar but smaller shape and size to the wafer or substrate (12) to be used therewith and in that the second holes (34) at the pad positions (36') are located in the margin of the sheet around the aperture (35).
Claim 4
Dependent Claim
42 words
A device as claimed in claim 2, further characterised in that the sheet (30') is of generally annular configurations, in that the first holes (42) at the pin locations are located in the margin of the sheet around the external periphery thereof.
Claim 5
Dependent Claim
59 words
A device as claimed in claim 1, 2 or 3, further characterised in that the portions of the conductors extending across the second holes (34) are each depressed into and through the respective aligned hole to form a smooth outwardly convex, contact (33A) projecting from the other end of the hole (34) to which a pad can be connected.
Claim 6
Independent Claim
38 words
A device as claimed in any one of claims 1 to 4, further characterised in that the portion of each conductor (33) extending to a pin-receiving-hole (42) is integral with a conductive lining (41) through the pin hole.
Claim 7
Independent Claim
67 words
A device as claimed in any one of claims 1 to 5, further characterised in that a second insulating sheet (30") of similar configuration to the first sheet (30') overlies the conductors (33) to form a laminar structure, the second sheet (30") being arranged to prevent or block solder flow between adjacent pads (36) and adjacent pins (46) during soldering of pads and pins to the device.
Claim 8
Independent Claim
38 words
A device as claimed in any one of claims 1 to 6, in combination with a semiconductor wafer or substrate (12), the contact pads being soldered (38) to the conductors (33) in alignment with the second holes (34).
Claim 9
Dependent Claim
40 words
A combination as claimed in claim 7, in combination with a connector block (14-17) having a multiplicity of connecting pins (46) secured therein, the connecting pins (46) passing into the first holes (42) and being soldered to the conductors (33).
Claim 10
Dependent Claim
160 words
An electronic circuit packaging member for interconnecting a ceramic substrate of the type having a multiple of electric connecting pads arranged about the periphery thereof, and a connector block arrangement of the type having a multiple of electric connecting pins arranged about the periphery of said ceramic substrate and spaced apart therefrom, said packaging member comprising a flat film of annular configuration having apertures near the inner periphery thereof registrable with said electric connecting pads and apertures near the outer periphery thereof registrable with said electric connecting pins, said film having conductive lands affixed thereto independent of each other, each of said lands being laid over one of said inner apertures and extending to a corresponding one of said outer apertures and having an aperture therein concentric with said outer aperture of said film, and one end of each of said lands being soldered to an electric connecting pad and the other end being soldered to an electric connecting pin.
Claim 11
Dependent Claim
160 words
An electronic circuit packaging member for interconnecting a ceramic substrate of the type having a multiple of electric connecting pads arranged about the periphery thereof, and a connector block arrangement of the type having a multiple of electric connecting pins arranged about the periphery of said ceramic substrate and spaced apart therefrom, said packaging member comprising a flat film of annular configuration having apertures near the inner periphery thereof registrable with said electric connecting pads and apertures near the outer periphery thereof registrable with said electric connecting pins, said film having conductive lands affixed thereto independent of each other, each of said lands being laid over one of said inner apertures and extending to a corresponding one of said outer apertures and having an aperture therein concentric with said outer aperture of said film, and one end of each of said lands being soldered to an electric connecting pad and the other end being soldered to an electric connecting pin.
References Cited (Backward Citations)
No citation records indexed.
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