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EP0081129A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Method of activating substrate surfaces for electroless metal plating

Assignee: Bayer AG
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Filing: 1982-11-20
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Granted: —
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Expires: 2002-11-20
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Abstract

Abstract Translated from German Eine schonende und verfahrenstechnisch einfache Methode zur Aktivierung von Substratoberflächen zum Zwecke der stromlosen Metallisierung besteht darin, daß man zur Aktivierung metallorganische Verbindungen von Elementen der 1. und 8. Nebengruppe des Periodensystems der Elemente verwendet, deren organischer Teil über die zur Metallbindung erforderlichen Gruppen hinaus wenigstens eine weitere funktionelle Gruppe aufweist. A gentle and procedurally simple method for activating substrate surfaces for the purpose of electroless metallization consists in the use of organometallic compounds of elements of the 1st and 8th subgroups of the periodic table of elements, the organic part of which at least beyond the groups required for metal bonding has another functional group.

Inventors

  • 👤 Kirkor Dr. Sirinyan
  • 👤 Henning Dr. Giesecke
  • 👤 Gerhard Dieter Dr. Wolf
  • 👤 Harold Dr. Ebneth
  • 👤 Rudolf Dr. Merten

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-09 14:29
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/18; C23C18/20; C23C18/28

Claims Analysis

Total Claims: 0
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References Cited (Backward Citations)

DE1521445A1 Cited
CH564093A5 Cited
CH592160A5 Cited
DE2527096B2 Cited

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