EP0090651A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Semiconductor chip assembly including a thermal radiator plate
Assignee: Fujitsu Ltd
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Filing: 1983-03-29
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Granted: —
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Expires: 2003-03-29
Abstract
Abstract A semiconductor chip assembly comprises a semiconductor substrate (11) and a radiator plate (15). An active region 12) is formed on one side of the semiconductor substrate (11). The radiator plate (15) is bonded to the other side of the semiconductor substrate (11). A recess (13) is formed on the other side of the substrate (11) to contain the radiator plate (15) to ncrease thermal coupling between the active region (12) and the plate (15) and to reduce the tendency of the plate (15) and substrate (11) assembly to buckle with changes in temperature.
Inventors
- 👤 Shunji Kashiwagi
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 17:35
CPC Classifications
H; H10; H10W; H10W40/00; H10W40/10; H10D; H10D62/00; H10D62/10; H10D62/117
Claims Analysis
Total Claims: 9
Claim 1
Independent Claim
63 words
A semiconductor chip assembly comprising a semiconductor substrate (11), on one side of which an active region (12) is formed and on the other side of which a radiator plate (15) is bonded, characterised in that a recess (13) is formed on the opposite side of the semiconductor substrate (11) and in that the radiator plate (15) is contained in the recess (13).
Claim 2
Dependent Claim
63 words
A semiconductor chip assembly comprising a semiconductor substrate (11), on one side of which an active region (12) is formed and on the other side of which a radiator plate (15) is bonded, characterised in that a recess (13) is formed on the opposite side of the semiconductor substrate (11) and in that the radiator plate (15) is contained in the recess (13).
Claim 3
Dependent Claim
29 words
A semiconductor chip assembly according to claim 1, in which the coefficient of heat expansion of the semiconductor substrate (11) is different from that of the radiator plate (15).
Claim 4
Dependent Claim
21 words
A semiconductor chip assembly according to claim 1 or 2, in which the semiconductor substrate (11) consists of silicon or gallium-arsenide.
Claim 5
Dependent Claim
27 words
A semiconductor chip assembly according to claims 1, 2 or 3 in which the radiator plate (15) is made from material consisting mainly of copper or silver.
Claim 6
Dependent Claim
31 words
A. semiconductor chip assembly according to any one of the preceding claims in which the recess (15) is surrounded on all sides by a thick portion (14) of the semiconductor substrate.
Claim 7
Dependent Claim
44 words
A semiconductor chip assembly according to any one of claims 1 to 4, in which the semiconductor substrate (11) is of a rectangular shape and in which the recess (15) has two thicker portions (l4') of the substrate formed along its two longitudinal edges.
Claim 8
Dependent Claim
38 words
A semiconductor chip assembly according to claim 5, or claim 6, in which the thickness of the radiator plate (15) is less than that of the substrate (11) at its thicker portions (14, 14') around the recess (15).
Claim 9
Dependent Claim
22 words
A semiconductor chip assembly according to any one of the preceding claims, in which the edges of the recess (15) are inclined.
References Cited (Backward Citations)
No citation records indexed.
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