Patent US4015104A successfully refreshed from Google Patents.
EP0095391A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Mounting leadless chip-carriers
Assignee: Fujitsu Ltd
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Filing: 1983-05-26
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Granted: —
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Expires: 2003-05-26
Abstract
Abstract In a holder for a leadless chip-carrier (30) having a plurality of electrode pads (32) provided at external surface portions of the chip-carrier, the holder has mutually-opposed side-wall portions, for receiving and holding such chip-carrier therebetween, and a plurality of inner contact members (14) extending adjacent to the said side wall portions so as to make electrical contact respectively with the electrode pads of such leadless chip-carrier when the holder is in use, the said inner contacts being in electrical connection with respective external contacts (15) which are provided at outer surface portions of the said holder for connection to external circuitry. Such a holder can be incorporated in a semiconductor device module comprising a package and the holder. Such a holder can allow a leadless chip-carrier to be easily removed, for example for replacement.
Inventors
- 👤 Kensaku Wada
- 👤 Hidehiko Akasaki
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-01 23:27
CPC Classifications
H; H10; H10W; H10W76/00; H10W76/10; H10W76/12; H10W76/15; H10W76/157; H05; H05K; H05K7/00; H05K7/02; H05K7/10; H05K7/1053; H05K7/1076; H10W90/00; H10W90/701; H10W70/00; H10W70/60; H10W70/67; H10W70/68; H10W70/682
Claims Analysis
Total Claims: 21
Claim 1
Independent Claim
114 words
A holder for accommodating a leadless chip carrier, said leadless chip carrier comprising a plurality of electrode pads formed on its outer surface, said holder comprising: a holder body having a recess portion for accommodating said leadless chip carrier, said recess portion having an inner wall; and a plurality of contact leads adapted to contact with said electrode pads of the leadless chip carrier, said contact leads being provided on the inner wall of said recess portion; each of said contact leads having an end exposed on the bottom surface of said holder body so as to form one of electrode pads, said electrode pads being adapted to be connected to an external circuit.
Claim 2
Dependent Claim
114 words
A holder for accommodating a leadless chip carrier, said leadless chip carrier comprising a plurality of electrode pads formed on its outer surface, said holder comprising: a holder body having a recess portion for accommodating said leadless chip carrier, said recess portion having an inner wall; and a plurality of contact leads adapted to contact with said electrode pads of the leadless chip carrier, said contact leads being provided on the inner wall of said recess portion; each of said contact leads having an end exposed on the bottom surface of said holder body so as to form one of electrode pads, said electrode pads being adapted to be connected to an external circuit.
Claim 3
Dependent Claim
20 words
A holder as set forth in claim 1, wherein said leadless chip carrier includes an erasable programmable read only memory.
Claim 4
Dependent Claim
15 words
A holder as set forth in claim 2 wherein said external circuit is a microcomputer.
Claim 5
Dependent Claim
13 words
A holder as set forth in claim 1 having a square-shaped bottom surface.
Claim 6
Dependent Claim
21 words
A holder as set forth in claim 1, wherein said recess portion is enclosed by a side wall of said holder.
Claim 7
Dependent Claim
39 words
A holder as set forth in claim 5, further comprising at least one cut portion for removing said leadless chip carrier by means of a tool, said cut portion being provided on a diagonal line of said side wall.
Claim 8
Dependent Claim
36 words
A holder as set forth in claim 1, wherein each of said contact leads has a spring means for ensuring the electrical contact between said electrode pads of said leadless chip carrier and said contact leads.
Claim 9
Dependent Claim
182 words
A semiconductor device module comprising: at least one semiconductor chip; a package accommodating said semiconductor chip, said package comprising a plurality of external terminals, a main surface, and a plurality of electrode pads provided on said main surface; and a holder for accommodating a leadless chip carrier, said holder being mounted on said main surface, said leadless chip carrier comprising a plurality of second electrode pads formed on its surface; said holder comprising a holder body having a recess portion for accommodating said leadless chip carrier, said recess portion having an inner wall, and a plurality of contact leads adapted to contact with said electrode pads of said leadless chip carrier, said contact leads being provided on the inner wall of said recess portion, each of said contact leads having an end exposed on the bottom surface of said holder body so as to form one of electrode pads, said electrode pads being connected to said electrode pads provided on said main surface of said package, and said leadless chip carrier being removably fitted in said recess portion of said holder body.
Claim 10
Dependent Claim
182 words
A semiconductor device module comprising: at least one semiconductor chip; a package accommodating said semiconductor chip, said package comprising a plurality of external terminals, a main surface, and a plurality of electrode pads provided on said main surface; and a holder for accommodating a leadless chip carrier, said holder being mounted on said main surface, said leadless chip carrier comprising a plurality of second electrode pads formed on its surface; said holder comprising a holder body having a recess portion for accommodating said leadless chip carrier, said recess portion having an inner wall, and a plurality of contact leads adapted to contact with said electrode pads of said leadless chip carrier, said contact leads being provided on the inner wall of said recess portion, each of said contact leads having an end exposed on the bottom surface of said holder body so as to form one of electrode pads, said electrode pads being connected to said electrode pads provided on said main surface of said package, and said leadless chip carrier being removably fitted in said recess portion of said holder body.
Claim 11
Dependent Claim
22 words
A semiconductor device module as set forth in claim 8, wherein said leadless chip carrier includes an erasable programmable read only memory.
Claim 12
Dependent Claim
18 words
A semiconductor device module as set forth in claim 8, wherein said holder has a square-shaped bottom surface.
Claim 13
Dependent Claim
37 words
A semiconductor device module as set forth in claim 10, wherein said main surface of said package is a square surface having the same area as the square surface of said square-shaped bottom surface of said holder.
Claim 14
Dependent Claim
22 words
A semiconductor device module as set forth in claim 9, wherein said semiconductor chip accommodated in said package is a microcomputer chip.
Claim 15
Dependent Claim
23 words
A semiconductor device module as set forth in claim 8, wherein said recess portion is enclosed by a side wall of said holder.
Claim 16
Dependent Claim
44 words
A semiconductor device module as set forth in claim 13, wherein said holder further comprises at least one cut portion for removing said leadless chip carrier by means of a tool, said cut portion being provided on a diagonal line of said side wall.
Claim 17
Dependent Claim
45 words
A semiconductor device module as set forth in claim 8, wherein each of said contact leads of said holder has a spring means for ensuring the electrical contact between said second electrode pads of said leadless chip carrier and said contact leads of said holder.
Claim 18
Dependent Claim
17 words
A semiconductor device module as set forth in claim 8, wherein said package is a flat package.
Claim 19
Dependent Claim
18 words
A semiconductor device module as set forth in claim 8, wherein said package is a dual inline package.
Claim 20
Dependent Claim
103 words
A holder (10) for a leadless chip-carrier (30) having a plurality of electrode pads (32) provided at external surface portions of the chip-carrier, the holder having mutually-opposed side wall portions, for receiving and holding such chip-carrier therebetween, and a plurality of inner contact members (14) extending adjacent to the said side wall portions so as to make electrical contact respectively with the electrode pads of such leadless chip-carrier when the holder is in use, the said inner contacts being in electrical connection with respective external contacts (15) which are provided at outer surface portions of the said holder for connection to external circuitry.
Claim 21
Dependent Claim
103 words
A holder (10) for a leadless chip-carrier (30) having a plurality of electrode pads (32) provided at external surface portions of the chip-carrier, the holder having mutually-opposed side wall portions, for receiving and holding such chip-carrier therebetween, and a plurality of inner contact members (14) extending adjacent to the said side wall portions so as to make electrical contact respectively with the electrode pads of such leadless chip-carrier when the holder is in use, the said inner contacts being in electrical connection with respective external contacts (15) which are provided at outer surface portions of the said holder for connection to external circuitry.
References Cited (Backward Citations)
No citation records indexed.
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