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EP0111706A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Sidewall isolation for gate of field effect transistor and process for the formation thereof

Assignee: International Business Machines Corp
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Filing: 1983-11-03
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Granted: —
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Expires: 2003-11-03
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Abstract

Abstract Recesses (13) are formed in the sidewall isolation (7, 8, 9) of the polysilicon gate (6) of a field effect transistor in order that a subsequently deposited metal film becomes discontinuous over the sidewall isolation. The recesses eliminate possible silicon diffusion paths over the sidewall isolation. The sidewall isolation is composed of layers (7, 8, 9) of different insulating materials (eg silicon dioxide (7, 9) and silicond nitride (8)) which can be differentially etched to provide the recesses (13) in the central layer (8).

Inventors

  • 👤 Subramanian Srikanteswara Iyer

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-10-31 11:15
CPC Classifications
H; H10; H10D; H10D64/00; H10D64/60; H10D64/66; H10D64/671; H10D30/00; H10D30/01; H10D30/021; H10D30/0212; H10D30/0223; H10D64/01; H10D64/021

Claims Analysis

Total Claims: 16
Claim 1
Independent Claim 53 words
A field effect transistor structure including a gate (6) provided with first and second layers (7, 8) of insulating materials on its sidewalls, the material of the first layer being different from that of the second layer, characterised by there being a recess (13) formed in one of the first and second layers.
Claim 2
Dependent Claim 53 words
A field effect transistor structure including a gate (6) provided with first and second layers (7, 8) of insulating materials on its sidewalls, the material of the first layer being different from that of the second layer, characterised by there being a recess (13) formed in one of the first and second layers.
Claim 3
Dependent Claim 35 words
A structure as claimed in claim 1, in which there is a third, outer layer of insulating material on the sidewalls of the gate and in which the recess is formed in the second layer.
Claim 4
Dependent Claim 19 words
A structure as claimed in claim 2, in which the first and third layers are of the same material.
Claim 5
Dependent Claim 17 words
A structure as claimed in any preceding claim, in which the first layer is of silicon dioxide.
Claim 6
Dependent Claim 16 words
A structure as claimed in claim 4, in which the second layer is of silicon nitride.
Claim 7
Dependent Claim 17 words
A structure as claimed in any preceding claim, in which the gate is composed of conductive polysilicon.
Claim 8
Dependent Claim 51 words
A process for forming a field effect transistor structure including forming first and second layers of insulating materials on the sidewall of a gate, the material of the first layer being different from that of the second layer, characterised by forming a recess in one of the first and second layers.
Claim 9
Dependent Claim 51 words
A process for forming a field effect transistor structure including forming first and second layers of insulating materials on the sidewall of a gate, the material of the first layer being different from that of the second layer, characterised by forming a recess in one of the first and second layers.
Claim 10
Dependent Claim 40 words
A process as claimed in claim 7, in which the first and second layers are of materials which etch at different rates in a predetermined etchant and the recess is formed by application of the predetermined etchant to the layers.
Claim 11
Dependent Claim 39 words
9 . A process as claimed in claim 7 or claim 8, further including forming a third, outer layer of insulating material on the sidewalls of the gate, and in which the recess is formed in the second layer.
Claim 12
Dependent Claim 19 words
A process as claimed in claim 9, in which the first and third layers are of the same material.
Claim 13
Dependent Claim 20 words
A process as claimed in any of claims 7 to 10, in which the first layer is of silicon dioxide.
Claim 14
Dependent Claim 16 words
A process as claimed in claim 11, in which the second layer is of silicon nitride.
Claim 15
Dependent Claim 54 words
A process as claimed in any of claims 7 to 12, in which the gate electrode is of conductive polysilicon, the process further including depositing a metallic layer over the field effect transistor structure and reacting the metallic layer with the semiconductor material including that of the gate electrode, with which it is contiguous.
Claim 16
Dependent Claim 24 words
A process as claimed in claim 13, in which the metallic layer is of titanium, cobalt, nickel or a metal of the platinum group.

References Cited (Backward Citations)

US4074300A Cited
EP0036573A2 Cited
GB2074374A Cited
US4330931A Cited

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