EP0151413A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Auto-selective metal deposition on dielectric surfaces
Assignee: Japan Kinoko Research Center Foundation
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Filing: 1985-01-17
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Granted: —
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Expires: 2005-01-17
Abstract
Abstract A method of plating a pattern of metal (e.g. copper or nickel) on a dielectric surface, i.e. surface of a dielectric material such as a synthetic resin or ceramic. The method comprises the preliminary step of masklessly treating the dielectric surface to selectively activate preselected areas thereof so that the dielectric surface in contact with a priming solution becomes catalytic, and thereby receptive to electroless metal deposition, selectively at those areas. The treated dielectric surface is contacted with an electroless plating solution to allow metal therefrom to auto-reductively deposit selectively at those catalized areas, thereby forming the pattern of metal desired on the dielectric surface.
Inventors
- 👤 Kiyoshi Inoue
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 22:03
CPC Classifications
C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/1612; C23C18/18; C23C18/1851; C23C18/1855; C23C18/1862; C23C18/1868; C23C18/1872; C23C18/1875; C23C18/1879; C23C18/20; C23C18/2006; C23C18/2013; C23C18/2026; C23C18/204; C23C18/28; C23C18/30; C23C18/31; C23C18/32; C23C18/34; C23C18/38; C23C18/40; C23C18/405; H; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/185; C23C18/1633; C23C18/1646; C23C18/165; C23C18/1653
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
91 words
1 . A method of plating a pattern of metal on a dielectric surface, comprising the steps of: a) masklessly treating the dielectric surface to selectively activate preselected areas thereof so that the dielectric surface in contact with a priming solution becomes catalytic, and thereby receptive to electroless metal deposition, selectively at said preselected areas; and b) contacting the treated dielectric surface with an electroless plating solution to allow metal therefrom to auto-reductively deposit selectively at said preselected catalized areas, thereby forming the pattern of metal desired on the dielectric surface.
Claim 2
Dependent Claim
91 words
1 . A method of plating a pattern of metal on a dielectric surface, comprising the steps of: a) masklessly treating the dielectric surface to selectively activate preselected areas thereof so that the dielectric surface in contact with a priming solution becomes catalytic, and thereby receptive to electroless metal deposition, selectively at said preselected areas; and b) contacting the treated dielectric surface with an electroless plating solution to allow metal therefrom to auto-reductively deposit selectively at said preselected catalized areas, thereby forming the pattern of metal desired on the dielectric surface.
Claim 3
Dependent Claim
34 words
The method according to claim 1 wherein in step a) the dielectric surface is so treated as defined by exposing the dielectric surface to irradiation by an energy beam selectively along said preselected areas.
Claim 4
Dependent Claim
26 words
The method according to claim 2 wherein said preselected areas while in contact with said priming solution are successively exposed to irradiation by the energy beam.
Claim 5
Dependent Claim
28 words
The method according to claim 2 wherein said preselected areas are successively exposed to irradiation by the energy beam and thereafter brought into contact with said priming solution.
Claim 6
Dependent Claim
42 words
The method according to claim 1 wherein in step a) the dielectric surface is so treated as defined by mechanically or thermomechanically roughing the dielectric surface selectively along said preselected areas and thereafter bringing said areas into contact with said priming solution.
Claim 7
Dependent Claim
31 words
The method according to claim 5 wherein said preselc- ted areas are successively roughed by tracing an operating abrasive tool in contact with the dielectric surface selectively along said preselected areas.
Claim 8
Dependent Claim
28 words
The method according to claim 5 wherein said preselected areas are successively roughed by exposing the dielectric surface to an abrasive or sand blasting selectively along said areas.
Claim 9
Dependent Claim
30 words
The method according to claim 5 wherein said preselected areas are successively roughed by tracing an operating thermo stylus in contact with the dielectric surface selectively along said preselected areas.
Claim 10
Dependent Claim
20 words
The method according to claim 1, 3, 4 or 5 wherein said priming solution comprises a solution of palladium chloride.
Claim 11
Dependent Claim
20 words
The method according to claim 1, 3, 4 or 5 wherein said priming solution comprises a solution of stannous chloride.
Claim 12
Dependent Claim
25 words
The method according to claim 1, 3, 4 or 5 wherein said priming solution comprises a combination of solutions of palladium chloride and stannous chloride.
Claim 13
Dependent Claim
43 words
The method according to claim 1, 2, 3, 4, 5, 6, 7 or 8, further comprising the step of c) electrodepositing metal on the pattern of metal formed on the dielectric substrate in step b) to increase the thickness of the metal thereof.
References Cited (Backward Citations)
No citation records indexed.
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