EP0180101A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Deposition of patterns using laser ablation
Assignee: International Business Machines Corp
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Filing: 1985-10-17
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Granted: —
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Expires: 2005-10-17
Abstract
Abstract 57 An improved technique is described for the formation of conducting patterns on substrates. This technique has particular utility in the provision of "seeding" layers which are often used as catalysis for electroless deposition of an overlying metal layer. The seed layer is provided by casting a polymer containing a seed constituent onto a substrate, after which the polymer is ablatively photodecomposed by far UV radiation of wavelengths less than 400 nm and sufficient energy fluence to create ablative photodecomposition. This exposes the seed constituent in the polymer in the irradiated areas. Electroless plating of a metal can then occur, the plating being limited to only those areas which have been selectively exposed by the laser irradiation. Thus, a seed layer is prepared by dry processing, in ( contrast with previous techniques using plating solutions to provide the seed layer.
Inventors
- 👤 Thomas Hall Baum
- 👤 Rangaswamy Srinivasan
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-25 06:27
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/01; H10W70/05; B; B23; B23K; B23K26/00; B23K26/02; B23K26/06; B23K26/064; B23K26/066; B23K26/36; B23K26/361; B23K26/40; C; C23; C23C; C23C18/00; C23C18/16; C23C18/1601; C23C18/1603; C23C18/1607; C23C18/1608; C23C18/1612; C23C18/1633; C23C18/1635; C23C18/1639; C23C18/1641; C23C18/1646; C23C18/165; C23C18/18; C23C18/1851; C23C18/1872; C23C18/1875; C23C18/1879; C23C18/1882; C23C18/20; C23C18/2006; C23C18/2046; C23C18/2053; C23C18/206; C23C18/2066; C23C18/31; C23C18/38; H05; H05K; H05K3/00; H05K3/10; H05K3/18; H05K3/181; H05K3/182; H05K3/185; B23K2101/00; B23K2101/04; B23K2101/12; B23K2101/34; B23K2103/00; B23K2103/08; B23K2103/30; B23K2103/42; B23K2103/50; B23K2103/52; H05K1/00; H05K1/02; H05K1/03; H05K1/0313; H05K1/0353; H05K1/0373; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0236; H05K2203/00; H05K2203/10; H05K2203/107
Claims Analysis
Total Claims: 25
Claim 1
Independent Claim
101 words
A method for forming an electrically continuous layer on a substrate, comprising the steps of: preparing a material capable of being applied as a resist-type layer onto said substrate, said material including seed constituents which can act as a seed layer for later formation of said electrically continuous layer, applying said resist-type layer to said substrate, irradiating said resist-type layer with far UV radiation of wavelengths less than 400 nm and sufficient energy fluence to ablatively photodecompose said resist-type layer to expose said seed constituents therein thereby producing said seed layer, and forming said electrically continuous layer over said seed layer.
Claim 2
Independent Claim
101 words
A method for forming an electrically continuous layer on a substrate, comprising the steps of: preparing a material capable of being applied as a resist-type layer onto said substrate, said material including seed constituents which can act as a seed layer for later formation of said electrically continuous layer, applying said resist-type layer to said substrate, irradiating said resist-type layer with far UV radiation of wavelengths less than 400 nm and sufficient energy fluence to ablatively photodecompose said resist-type layer to expose said seed constituents therein thereby producing said seed layer, and forming said electrically continuous layer over said seed layer.
Claim 3
Dependent Claim
15 words
The method of claim 1, where said resist-type layer is irradiated in selected areas thereof.
Claim 4
Dependent Claim
16 words
The method of claim 1, where said resist-type layer includes said seed constituents in a polymer.
Claim 5
Dependent Claim
19 words
The method of claim 3, where said polymer is ablatively photodecomposed at a greater rate than said seed constituents.
Claim 6
Dependent Claim
19 words
The method of claim 1, where said electrically continuous layer is formed by electroplating onto said exposed seed constituents.
Claim 7
Dependent Claim
18 words
The method of claim 5, where said electrically continuous layer is copper and said seed constituents are palladium.
Claim 8
Dependent Claim
12 words
The method of claim 1, where said electrically continuous layer is copper.
Claim 9
Dependent Claim
17 words
The method of claim 1, where said resist-type layer is comprised of metal particles in a polymer.
Claim 10
Dependent Claim
23 words
The method of claim 1, where said resist-type layer is applied to said substrate by spinning or spraying it on to said substrate.
Claim 11
Dependent Claim
11 words
The method of claim 1, where said substrate is electrically insulating.
Claim 12
Dependent Claim
24 words
The method of claim 1, where said substrate is selected from the group consisting of silica, ceramics, inorganic polymers, organic polymers, and resist-type polymers.
Claim 13
Independent Claim
136 words
A method for the electroless plating of copper onto a substrate including a seed layer thereon which acts as a catalyst for said electroless plating, said method comprising the steps of: preparing a polymer of Pd in a polymer binder which is capable of being applied as a layer to said substrate and adhering thereto, applying said polymer to said substrate as a layer thereon, ablatively photodecomposing said polymer by irradiating said polymer with far UV radiation of wavelengths less than 400 nm and energy fluence sufficient to cause ablative photodecomposition of said polymer in order to expose Pd metal therein, electrolessly plating copper onto said exposed Pd metal, said Pd metal acting as a seed layer catalyst for the electroless deposition of said copper, said copper being deposited to a thickness which is electrically continuous.
Claim 14
Independent Claim
136 words
A method for the electroless plating of copper onto a substrate including a seed layer thereon which acts as a catalyst for said electroless plating, said method comprising the steps of: preparing a polymer of Pd in a polymer binder which is capable of being applied as a layer to said substrate and adhering thereto, applying said polymer to said substrate as a layer thereon, ablatively photodecomposing said polymer by irradiating said polymer with far UV radiation of wavelengths less than 400 nm and energy fluence sufficient to cause ablative photodecomposition of said polymer in order to expose Pd metal therein, electrolessly plating copper onto said exposed Pd metal, said Pd metal acting as a seed layer catalyst for the electroless deposition of said copper, said copper being deposited to a thickness which is electrically continuous.
Claim 15
Dependent Claim
15 words
The method of claim 14, where said polymer of Pd is cast onto said substrate.
Claim 16
Dependent Claim
12 words
The method of claim 14, where said substrate is an inorganic material.
Claim 17
Dependent Claim
12 words
A method of claim 14, where said substrate is an organic material.
Claim 18
Independent Claim
103 words
A method for preparing a metal layer on a substrate, comprising the steps of: dispersing particles of said metal in a polymer complex, said polymer complex being capable of being ablatively photodecomposed by the incidence of far UV radiation thereon, applying said metal-containing polymer to said substrate, as a layer thereon, said metal-containing polymer adhering to said substrate, ablatively photodecomposing said layer by irradiating said layer with far UV radiation of wavelengths less than 400 nm and sufficient energy fluence to cause ablative photodecomposition thereof, said decomposition exposing said metal in said metal-containing polymer layer, thereby forming a metal layer on said substrate.
Claim 19
Independent Claim
103 words
A method for preparing a metal layer on a substrate, comprising the steps of: dispersing particles of said metal in a polymer complex, said polymer complex being capable of being ablatively photodecomposed by the incidence of far UV radiation thereon, applying said metal-containing polymer to said substrate, as a layer thereon, said metal-containing polymer adhering to said substrate, ablatively photodecomposing said layer by irradiating said layer with far UV radiation of wavelengths less than 400 nm and sufficient energy fluence to cause ablative photodecomposition thereof, said decomposition exposing said metal in said metal-containing polymer layer, thereby forming a metal layer on said substrate.
Claim 20
Dependent Claim
10 words
The method of claim 18, where said metal is Pd.
Claim 21
Dependent Claim
28 words
The method of claim 18, where said metal is substantially continuous in the region of said metal containing polymer which has been exposed to said far UV radiation.
Claim 22
Dependent Claim
20 words
The method'of claim 18, where said metal-containing polymer is applied as a layer to a thickness less than 500 angstroms.
Claim 23
Dependent Claim
12 words
The method of claim 18, where said polymer is an organic polymer.
Claim 24
Dependent Claim
26 words
The method of claim 18, where said metal-containing polymer is exposed to said far UV radiation in selected areas thereof to create a patterned metal layer.
Claim 25
Dependent Claim
10 words
The method of claim 23, wherein said metal is Pd.
References Cited (Backward Citations)
No citation records indexed.
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