Radiation shield system

Abstract

Abstract A methodology for packaging and grounding electronic devices including distributive data processing systems wherein a Main Processing Unit (MPU) and power supply are packaged within a common housing. The MPU and other electrical components are placed on a common support card or substrate. The substrate is provided with plugs for mating with the power supply and |/α connectors for mating with devices which may be remotely attached thereto. Each connector is fitted with a shielded receptacle that coacts with the common housing to provide EMC shielding for the MPU and other electrical components. The figure shows the first part or section of the MPU housing (30) which functions as a shielding envelope. The housing includes two compartments (32, 34). A first compartment (32) provides the nesting area for the power supply. Similarly, a compartment (34) provides the nesting area for the main logic card and feature logic cards. A bottom guide rail (36) and a top guide rail (38) are fabricated on the inside walls of the side member. The guide rails support a lower main logic and upper feature logic cards. The logic cards are placed on the guide rails through appropriate openings in front wall (35). The packaging is such that an untrained person may replace the card without compromising the integrity of the EMC shield.

Inventors

• 👤 Albert Nottly Gore Iii
• 👤 Ronald Prestly Mcadams
• 👤 Robert Carlton Lynch
• 👤 Gregory Andrew Shekita

Bibliographic Details