Reactive ion etching deposition apparatus and method of using it
Abstract
Abstract The cathode (31) in a reactive ion etching and deposition apparatus is in the form of a single plate having a matrix of cylindrical hollows (37) therein, each hollow producing a hollow cathode glow when the apparatus is energised. The aspect ratio (largest dimension of each hollow cross-section/depth of the hollow) is preferably at least 1.5. In operation of the apparatus, an RF voltage is applied between the cathode and an evacuated chamber in which the cathode is disposed through a suitable matching network. A plasma gas is supplied from a point outside the cathode and a suitable pumping system is used to maintain operating pressures in the 0.1 to 400 millitorr range.
Inventors
- 👤 Bruce Bumble
- 👤 Jerome John Cuomo
- 👤 Joseph Skinner Logan
- 👤 Steven Mark Rossnagel
Bibliographic Details
Claims Analysis
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