EP0211619A2
Expired / Lapsed
EP
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A multilayer ceramic circuit board
Assignee: Hitachi Ltd
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Filing: 1986-07-31
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Granted: —
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Expires: 2006-07-31
Abstract
Abstract A ceramic insulating layer (2) for the multilayer ceramic circuit board (11) consists of 60 wt% of crystallized glass and 40 wt% of a filler such as silicon dioxide bonded by the crystallized glass, which consists of 6-15 wt% of lithium oxide, 70-90 wt% of silicon dioxide, 1-8 wt% of aluminum oxide, 1-5 wt% of alkaline metal oxide other than lithium oxide and 2-5 wt% of alkaline earth metal oxide. The sintered ceramic insulating layer (2) has a dielectric constant below 6.1 and a flexural strength above 150 MPa and is cofirable with a wiring conductor layer of such as gold, silver and copper.
Inventors
- 👤 Hiroichi Shinohara
- 👤 Nobuyuki Ushifusa
- 👤 Kousei Nagayama
- 👤 Satoru Ogihara
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 15:56
CPC Classifications
H; H10; H10W; H10W70/00; H10W70/60; H10W70/611; C; C03; C03C; C03C10/00; C03C10/0018; C03C10/0027; H10W70/67; H10W70/68; H10W70/685; H10W70/69; H10W70/692; H05; H05K; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K3/00; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; H05K3/4644; H05K3/4673; H05K3/4676; H10W72/00; H10W72/071; H10W72/072; H10W72/07251; H10W72/20; H10W90/00; H10W90/701; H10W90/721; H10W90/724; Y; Y10; Y10S; Y10S428/00; Y10S428/901; Y10T; Y10T428/00; Y10T428/24; Y10T428/24802; Y10T428/24926
Claims Analysis
Total Claims: 8
Claim 1
Independent Claim
214 words
A multilayer ceramic circuit board (11) formed of a plurality of ceramic circuit board units laminated together, each unit including a ceramic insulating layer (2), a patterned electrical conductor layer (1) supported on said ceramic insulating layer (2) and through hole electrical conductors (12) for connecting said patterned electrical conductor layers (1) of respective ceramic circuit board units to form a predetermined wiring circuit, said electrical conductor layers (1) and said through hole electrical conductors (12) essentially consisting of a metal selected from copper, silver, gold and alloys thereof, characterized in that said ceramic insulating layer (2) essentially consists of 50-95 wt% of a crystallized glass and 5-50 wt% of a filler selected from silicon dioxide, p-eucryptite and aluminum oxide, and said crystallized glass esssentially consists of 5-20 wt% of lithium oxide, 60-90 wt% of silicon dioxide, 1-10 wt% of aluminum oxide, 1-5 wt% of alkaline metal oxide other than lithium oxide, optionally up to 5 wt% of alkaline earth metal oxide, optionally up to 13 wt% of boron oxide and optionally up to 3 wt% of calcium fluoride, said glass having been converted to a crystallized state during sintering of said glass and said filler at a temperature below a melting temperature of said patterned electrical conductors and said through hole electrical conductors.
Claim 2
Dependent Claim
214 words
A multilayer ceramic circuit board (11) formed of a plurality of ceramic circuit board units laminated together, each unit including a ceramic insulating layer (2), a patterned electrical conductor layer (1) supported on said ceramic insulating layer (2) and through hole electrical conductors (12) for connecting said patterned electrical conductor layers (1) of respective ceramic circuit board units to form a predetermined wiring circuit, said electrical conductor layers (1) and said through hole electrical conductors (12) essentially consisting of a metal selected from copper, silver, gold and alloys thereof, characterized in that said ceramic insulating layer (2) essentially consists of 50-95 wt% of a crystallized glass and 5-50 wt% of a filler selected from silicon dioxide, p-eucryptite and aluminum oxide, and said crystallized glass esssentially consists of 5-20 wt% of lithium oxide, 60-90 wt% of silicon dioxide, 1-10 wt% of aluminum oxide, 1-5 wt% of alkaline metal oxide other than lithium oxide, optionally up to 5 wt% of alkaline earth metal oxide, optionally up to 13 wt% of boron oxide and optionally up to 3 wt% of calcium fluoride, said glass having been converted to a crystallized state during sintering of said glass and said filler at a temperature below a melting temperature of said patterned electrical conductors and said through hole electrical conductors.
Claim 3
Dependent Claim
32 words
A multilayer ceramic circuit board according to claim 1 wherein said ceramic insulating layers (2) essentially consist of about 60 wt% of said crystallized glass and about 40 wt% of said filler.
Claim 4
Dependent Claim
52 words
A multilayer ceramic circuit board according to claim I or claim 2 wherein said crystallized glass essentially consists of 6-15 wt% of lithium oxide, 70-90 wt% of silicon dioxide, 1-8 wt% of aluminum oxide, 1-5 wt% of alkaline metal oxide other than lithium oxide and 2-5 wt% of alkaline earth metal oxide.
Claim 5
Dependent Claim
67 words
A multilayer ceramic circuit board according to claim I or claim 2 wherein said crystallized glass essentially consists of 6-15 wt% of lithium oxide, 70-90 wt% of silicon dioxide, 1-8 wt% of aluminum oxide, 1-5 wt% of alkaline metal oxide other than lithium oxide, 2-5 wt% of alkaline earth metal oxide and at least one of 3-13 wt% of boron oxide and 1-3 wt% of calcium fluoride.
Claim 6
Dependent Claim
115 words
A ceramic insulating substrate (2) e.g. for mounting a hybrid integrated circuit, essentially consisting of 50-95 wt% of a crystallized glass and 5-50 wt% of a filler selected from silicon dioxide, p-eucryptite and aluminum oxide, said crystallized glass essentially consisting of 5-20 wt% of lithium oxide, 60-90 wt% of silicon dioxide, 1-10 wt% of aluminum oxide, 1-5 wt% of alkaline earth metal oxide other than lithium oxide, optionally up to 5 wt% of alkaline earth metal oxide, optionally up to 13 wt% of boron oxide and optionally up to 3 wt% of calcium fluoride, and having been converted to a crystallized state during sintering of said glass and said filler at a temperature below 1,000°C.
Claim 7
Dependent Claim
115 words
A ceramic insulating substrate (2) e.g. for mounting a hybrid integrated circuit, essentially consisting of 50-95 wt% of a crystallized glass and 5-50 wt% of a filler selected from silicon dioxide, p-eucryptite and aluminum oxide, said crystallized glass essentially consisting of 5-20 wt% of lithium oxide, 60-90 wt% of silicon dioxide, 1-10 wt% of aluminum oxide, 1-5 wt% of alkaline earth metal oxide other than lithium oxide, optionally up to 5 wt% of alkaline earth metal oxide, optionally up to 13 wt% of boron oxide and optionally up to 3 wt% of calcium fluoride, and having been converted to a crystallized state during sintering of said glass and said filler at a temperature below 1,000°C.
Claim 8
Dependent Claim
44 words
A method of making a ceramic circuit board according to claim 1 or a ceramic substrate according to claim 5 wherein said glass in amorphous state and said filler are mixed and then sintered so that said glass is converted to the crystallized state.
References Cited (Backward Citations)
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