EP0227066A1
Expired / Lapsed
EP
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A method of joining metallic components
Assignee: Olin Corp
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Filing: 1986-12-19
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Granted: —
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Expires: 2006-12-19
Abstract
Abstract A method of joining metallic layers of foil l0, l2 spaced apart from each other a desired distance by a metallic component l4 disposed between the layers of foil is disclosed. The metallic component l4 is selected to be in the semi-solid condition at a desired processing temperature. The assembly is first heated to the processing temperature and then cooled so that the metallic component l4 is bonded to the metallic layers of foil l0, l2.
Inventors
- 👤 Michael J. Pryor
- 👤 William G. Watson
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-11-08 20:49
CPC Classifications
B; B23; B23K; B23K31/00; H; H05; H05K; H05K3/00; H05K3/40; H05K3/4038; H05K3/4046; H05K1/00; H05K1/02; H05K1/03; H05K1/0306; H05K2201/00; H05K2201/03; H05K2201/0332; H05K2201/0335; H05K2201/0355; H05K2201/10; H05K2201/10227; H05K2201/10416; H05K3/46; H05K3/4611; H05K3/4626; H05K3/4629; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/49126
Claims Analysis
Total Claims: 18
Claim 1
Independent Claim
133 words
A method of joining metallic components, characterized by the steps of: providing a first metal or alloy component l0; providing a second metal or alloy component l2, said second metal or alloy component l2 being spaced a desired distance from said first metal or alloy component l0; providing a first metal alloy bonding component l4, said first component being disposed between and in contact with said first and second components; heating the assembly of said first and second components and said first bonding component to a desired processing temperature wherein said metal alloy bonding component is in the semi-solid condition with a volume percent of liquid from about 2 to about 40%; and cooling said assembly whereby said metal alloy bonding component is bonded to said first and second metal or alloy components.
Claim 2
Independent Claim
133 words
A method of joining metallic components, characterized by the steps of: providing a first metal or alloy component l0; providing a second metal or alloy component l2, said second metal or alloy component l2 being spaced a desired distance from said first metal or alloy component l0; providing a first metal alloy bonding component l4, said first component being disposed between and in contact with said first and second components; heating the assembly of said first and second components and said first bonding component to a desired processing temperature wherein said metal alloy bonding component is in the semi-solid condition with a volume percent of liquid from about 2 to about 40%; and cooling said assembly whereby said metal alloy bonding component is bonded to said first and second metal or alloy components.
Claim 3
Independent Claim
40 words
The method of claim l further characterized by the step of selecting said first metal alloy bonding component to be in the semi-solid condition at the processing temperature with a volume percent of liquid from about l0 to about 30%.
Claim 4
Independent Claim
60 words
The method of claim l or 2 further characterized by the step of selecting said first metal alloy bonding component of a length to maintain contact with said first and second metal or alloy components throughout said step of heating, said first metal alloy bonding component further being in selective contact with said first and second metal or alloy components.
Claim 5
Dependent Claim
41 words
The method of claim 3 further characterized by the step of selecting said first metal alloy bonding component to be essentially a length equal to said desired distance prior to heating, and to essentially retain this length in the semi-solid condition.
Claim 6
Independent Claim
34 words
The method of any one of claims l to 4 further characterized by the step of selecting said first and second components of a material from the group consisting of copper and copper alloy.
Claim 7
Dependent Claim
69 words
The method of claim 5 further characterized by the step of selecting said first metal alloy bonding component essentially of an element from the group consisting of: about 2 to about l3% Sn, about 0.2 to about 4% P, about 5 to about l5% Sb, about 3 to about 6% Si, about 4 to about l2% As, and mixtures thereof; up to about 4% Fe; and the balance Cu.
Claim 8
Dependent Claim
62 words
The method of claim 5 or 6 further characterized by the assembly of said first and second components and said first bonding component being heated to a desired processing temperature within the range of about 600° to about l000°C where said first and second components are in the solid condition and said first metal alloy bonding component is in the semi-solid condition.
Claim 9
Independent Claim
51 words
The method of any one of claims l to 7 further characterized by the step of selecting said first and second metal or alloy components from first and second layers of foil and said first metal alloy bonding component l0 from a wire of less than about 25 mils in diameter.
Claim 10
Dependent Claim
23 words
The method of claim 8 further characterized by the step of selecting said wire with a diameter of less than about l0 mils.
Claim 11
Dependent Claim
124 words
l0. The method of any one of claims l to 9 further characterized by the step of forming a multi-layer device 30 comprising the steps of: providing a first ceramic substrate l6, said first substrate having a glass coating on opposite surfaces thereof and a first through-hole l8 extending through the glass coated substrate; disposing the first substrate between said first and second metal or alloy components l0, l2 whereby said first and second components are spaced the desired distance from each other; disposing said first metal bonding component 24 within said first through-hole whereby heating the first and second components, the first bonding component and the substrate to the processing temperature and subsequently cooling the components and the substrate forms a multi-layer device.
Claim 12
Independent Claim
50 words
The method of any one of claim l to l0 further characterized by the step of selecting said first and second metal or alloy components from first and second layers of foil and said first metal alloy bonding component from a wire of less than about 25 mils in diameter.
Claim 13
Independent Claim
22 words
The method of claim ll further characterized by the step of forming electrical circuitry in said first and second layers of foil.
Claim 14
Independent Claim
130 words
The method of any one of claims l0 to l2 further characterized by the steps of: providing a second ceramic substrate l6′, said second substrate having a glass coating on opposite surfaces thereof and a second through-hole l8′ extending therethrough; disposing a first surface of said second ceramic substrate on said first layer of foil 28; providing a second metal alloy bonding component 24′ within said second through-hole l8′; providing a third layer of metal or alloy foil 20′; disposing said third layer of foil on a second surface of said second ceramic substrate l6′; and heating the resulting stacked layers of said first and second ceramic substrates and said first, second and third layers of foil to bond said layers together whereby a multi-layer circuit assembly 30 is formed.
Claim 15
Independent Claim
20 words
The method of claim l3 further characterized by the step of forming electrical circuitry in said third layer of foil.
Claim 16
Independent Claim
32 words
The method of claim l3 or l4 further characterized by the step of selecting said secondary metal alloy bonding component of essentially the same material as said first metal alloy bonding component.
Claim 17
Independent Claim
62 words
The method of any one of claims l3 to l5 further characterized by the step of selecting said second metal alloy bonding component 24′ of a length to maintain contact with said first and third layers of foil throughout said step of heating, said second metal alloy bonding component further being in selective contact with said first and third layers of foil.
Claim 18
Independent Claim
60 words
The method of any one of claims l3 to l6 further characterized by said stacked layers are heated to a desired processing temperature within the range of about 600°C to about l000°C where said first, second and third layers of foil are on the solid condition and the first and second metal alloy bonding components are in the semi-solid condition.
References Cited (Backward Citations)
US4106956A
Cited
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