EP0246744A2
Expired / Lapsed
EP
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IC card and method of manufacturing the same
Assignee: Toshiba Corp
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Filing: 1987-03-31
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Granted: —
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Expires: 2007-03-31
Abstract
Abstract An IC card comprises a thermoplastic resin core sheet (1) and IC chip (3) bearing a conductive projection (5) formed on an electrode of IC chip (3), the IC chip (3) being embedded in the core sheet in such a manner that the exposed top surface of the conductive projection is made flush with the main surface of the core sheet. A conductive layer pattern (6) formed on the main surface of the core sheet is extended for contact with the exposed top surface.
Inventors
- 👤 Masayuki C/O Patent Division Ohuchi
- 👤 Hiroshi C/O Patent Division Oodaira
- 👤 Kenichi C/O Patent Division Yoshida
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-24 11:17
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/01; H10W72/0198; G; G06; G06K; G06K19/00; G06K19/06; G06K19/067; G06K19/07; G06K19/077; G06K19/07745; H10W70/00; H10W70/01; H10W70/05; H10W70/099; H10W70/60; H10W70/62; H10W70/65; H10W70/699; H10W72/012; H10W90/00; H10W90/10; Y; Y10; Y10T; Y10T29/00; Y10T29/49; Y10T29/49002; Y10T29/49117; Y10T29/49124; Y10T29/4913
Claims Analysis
Total Claims: 13
Claim 1
Independent Claim
116 words
An IC card comprising an insulating core sheet, a semiconductor IC chip provided with an electrode and embedded in said core sheet, and a conductive layer pattern deposited on said core sheet for being connected to said electrode, characterized in that said semiconductor IC chip (3) is provided with a conductive projection (5) formed on said electrode (4) and is embedded in said core sheet (1) in such a manner that the exposed top surface of said conductive projection is made flush with the main surface of said core sheet on which said conductive layer pattern is deposited and that said conductive layer pattern (6) is connected with said conductive projection at said exposed top surface.
Claim 2
Dependent Claim
116 words
An IC card comprising an insulating core sheet, a semiconductor IC chip provided with an electrode and embedded in said core sheet, and a conductive layer pattern deposited on said core sheet for being connected to said electrode, characterized in that said semiconductor IC chip (3) is provided with a conductive projection (5) formed on said electrode (4) and is embedded in said core sheet (1) in such a manner that the exposed top surface of said conductive projection is made flush with the main surface of said core sheet on which said conductive layer pattern is deposited and that said conductive layer pattern (6) is connected with said conductive projection at said exposed top surface.
Claim 3
Independent Claim
165 words
A method for manufacturing an IC card involving a thermoplastic resin core sheet and a semiconductor IC chip embedded in said core sheet, characterized in that said method comprises the steps of: preparing said thermoplastic resin core sheet (1) with a greater thickness than that of said semiconductor IC chip (3) and forming at least one hole (2) penetrating said core sheet (1); forming a conductive projection (5) on an electrode (4) deposited on said semiconductor IC chip (3); inserting said semiconductor IC chip into said penetrating hole with said conductive projection (5) positioned at the side of the main surface of said core sheet; plastically deforming said core sheet (1) involving said inserted semiconductor IC chip by applying heat and pressure between said main and opposite surfaces, until the exposed top surface of said conductive projection is made flush with said main surface; and depositing a conductive layer pattern (6) on said main surface so as to be contacted with said exposed top surface.
Claim 4
Independent Claim
165 words
A method for manufacturing an IC card involving a thermoplastic resin core sheet and a semiconductor IC chip embedded in said core sheet, characterized in that said method comprises the steps of: preparing said thermoplastic resin core sheet (1) with a greater thickness than that of said semiconductor IC chip (3) and forming at least one hole (2) penetrating said core sheet (1); forming a conductive projection (5) on an electrode (4) deposited on said semiconductor IC chip (3); inserting said semiconductor IC chip into said penetrating hole with said conductive projection (5) positioned at the side of the main surface of said core sheet; plastically deforming said core sheet (1) involving said inserted semiconductor IC chip by applying heat and pressure between said main and opposite surfaces, until the exposed top surface of said conductive projection is made flush with said main surface; and depositing a conductive layer pattern (6) on said main surface so as to be contacted with said exposed top surface.
Claim 5
Dependent Claim
26 words
An IC card-manufacturing method according to claim 2, characterized in that said conductive projection (5) is prepared from a softer material than said semiconductor IC chip.
Claim 6
Dependent Claim
39 words
An IC card-manufacturing method according to claim 3, characterized in that said conductive projection (5) is prepared from at least one metal selected from the group consisting of Au, Cu, Ag, Aℓ, Zn, Pd, Sn, Os, Pt and Ir.
Claim 7
Dependent Claim
42 words
An IC card-manufacturing method according to claim 3, characterized in that said conductive projection is made of an alloy prepared from at least two metals selected from the group consisting of Pd, Sn, In, Ag, Ga, Au, Bi, Te, Ge and Sb.
Claim 8
Dependent Claim
26 words
An IC card-manufacturing method according to claim 3, characterized in that said conductive projection is prepared from a mass composed of a metal and a resin.
Claim 9
Dependent Claim
37 words
An IC card-manufacturing method according to claim 2, characterized in that said conductive projection (5) is formed by any of the following processes: ball bonding, electroplating, vacuum deposition, sputtering, ion plating, laser growing, transcripting, dipping and dispensing.
Claim 10
Dependent Claim
67 words
An IC card-manufacturing method according to claim 2, characterized in that said conductive projection is formed in such a manner that a distance from the top surface of said conductive projection to that of said semiconductor IC chip is defined to be equal to or longer than a measurement arrived at by subtracting the thickness of said semiconductor IC chip from that of said thermoplastic core sheet.
Claim 11
Dependent Claim
45 words
An IC card-manufacturing method according to claim 2, characterized in that said thermoplastic core sheet is prepared from at least one resin selected from the group consisting of polycarbonate, polyvinyl chloride, polyvinyl chloride-acetate copolymer, polysulfone, polyethylene terephthalate, polyetherketone, polymethylpenten, polyallylate, polyether-sulfone, polyether-imide, polyphenylene-sulfide and ABS.
Claim 12
Dependent Claim
104 words
An IC card-manufacturing method according to claim 2, characterized in that said conductive layer pattern is printed on the surface of the thermoplastic resin core sheet by means of conductive paste formed by kneading at least one of the groups consisting of metal powder, metal alloy powder and metal oxide powder with a resin, said metal powder being prepared from at least one metal selected from the group consisting of Au, Ag, Cu , Pt, Ni, Sn, W, Mo, Pd, SiC, C and RuO₂ and said metal alloy powder being formed of a metal alloy composed of at least two of said metal group.
Claim 13
Dependent Claim
68 words
An IC card-manufacturing method according to claim 2, characterized in that said conductive layer pattern is prepared by depositing at least one metal selected from the group consisting of Au, Ag, Cu, Pt, Ni, Sn, W and Mo on the main surface of said core sheet by one of the following processes: vacuum depositing, sputtering, electroless plating, and then patterning said deposited metal layer by means of photolithography.
References Cited (Backward Citations)
No citation records indexed.
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