EP0256778A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Multi-layer printed circuit structure
Assignee: Individual
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Filing: 1987-08-05
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Granted: —
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Expires: 2007-08-05
Abstract
Abstract A multi-layer PC board structure is created by successively building PC board layers of metal and insulator on a carrier (708). Each layer is built sucessively by building a layer of circuitry, a layer of inter-layer connectors ("vias"), and a layer of protective "caps" to allow the formation of voids and throughholes. Each layer of circuitry, vias, and caps is generally built by successive deposition of a photoresist layer (714), exposure of the photoresist layer under a mask (723), and plating of metal (722, 724, 710). Photoresist material (714) is stripped away at appropriate process steps and replaced with a flowable polyimide insulator (712) which may be locally tailored for a desired thermal coefficient of expansion ("TCE") and a desired rigidity. The method is adapted to create PC boards with a center-oriented thermal plane ("COTP") (731) with connectors which extend completely through, without any hard tooling. The method is also adapted to create extended three-dimensional voids within the completed PC board, and arbitrary through-holes which extend completely through the PC board, without any hard tooling.
Inventors
- 👤 Ronald Krajewski
- 👤 Laura Krajewski
- 👤 Patrick Johnston
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 19:57
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4644; H05K3/4647; H05K3/10; H05K3/20; H05K3/205; H05K3/4682; H05K2201/00; H05K2201/01; H05K2201/0137; H05K2201/0154; H05K2203/00; H05K2203/01; H05K2203/0147; H05K2203/0152; H05K2203/07; H05K2203/0703; H05K2203/0726; H05K2203/0733; H05K3/22; H05K3/24; H05K3/243
Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
31 words
A printed circuit board, comprising: connector pad means for forming a contact with a connector element, which is substantially electrically and mechanically connective, and which is created without hard tooling operations.
Claim 2
Dependent Claim
31 words
A printed circuit board, comprising: connector pad means for forming a contact with a connector element, which is substantially electrically and mechanically connective, and which is created without hard tooling operations.
Claim 3
Dependent Claim
33 words
A printed circuit board, comprising: connector pad means for forming a contact with a connector element, which is substantially electrically and mechanically connective, and which is created by successive deposition of layered materials.
Claim 4
Dependent Claim
33 words
A printed circuit board, comprising: connector pad means for forming a contact with a connector element, which is substantially electrically and mechanically connective, and which is created by successive deposition of layered materials.
Claim 5
Dependent Claim
18 words
A printed circuit board, comprising: a void of substantially predetermined shape and size, created without hard tooling operations.
Claim 6
Dependent Claim
18 words
A printed circuit board, comprising: a void of substantially predetermined shape and size, created without hard tooling operations.
Claim 7
Dependent Claim
20 words
A printed circuit board, comprising: a void of substantially predetermined shape and size, created by successive deposition of layered materials.
Claim 8
Dependent Claim
20 words
A printed circuit board, comprising: a void of substantially predetermined shape and size, created by successive deposition of layered materials.
Claim 9
Dependent Claim
28 words
A printed circuit board as claimed in claim 3 or 4, wherein said void is accessible to an external probe on a side of said printed circuit board.
Claim 10
Dependent Claim
23 words
A printed circuit board, comprising: a region, including circuit metal and insulator, with a substantially predetermined and substantially uniform thermal coefficient of expansion.
Claim 11
Dependent Claim
23 words
A printed circuit board, comprising: a region, including circuit metal and insulator, with a substantially predetermined and substantially uniform thermal coefficient of expansion.
Claim 12
Dependent Claim
19 words
A printed circuit board, comprising: a region, including circuit metal and insulator, which is substantially insusceptible to thermal stress.
Claim 13
Dependent Claim
19 words
A printed circuit board, comprising: a region, including circuit metal and insulator, which is substantially insusceptible to thermal stress.
Claim 14
Dependent Claim
23 words
A printed circuit board, comprising: (a) a center-oriented thermal plane; (b) a circuit metal layer on a side of said center-oriented thermal plane.
Claim 15
Dependent Claim
23 words
A printed circuit board, comprising: (a) a center-oriented thermal plane; (b) a circuit metal layer on a side of said center-oriented thermal plane.
Claim 16
Dependent Claim
26 words
A printed circuit board as claimed in claim 8, further comprising: (a) a second circuit metal layer on a second side of said center-oriented thermal plane.
Claim 17
Dependent Claim
20 words
A printed circuit board, comprising: a region, including circuit metal and insulator, with a substantially predetermined and substantially uniform rigidity.
Claim 18
Dependent Claim
20 words
A printed circuit board, comprising: a region, including circuit metal and insulator, with a substantially predetermined and substantially uniform rigidity.
Claim 19
Dependent Claim
38 words
A printed circuit board, comprising: a region, including circuit metal and insulator, with a substantially predetermined and substantially uniform electrical property; said electrical property being a member of the class consisting of capacitance, inductance, and dielectric constant, resistivity.
Claim 20
Dependent Claim
38 words
A printed circuit board, comprising: a region, including circuit metal and insulator, with a substantially predetermined and substantially uniform electrical property; said electrical property being a member of the class consisting of capacitance, inductance, and dielectric constant, resistivity.
Claim 21
Dependent Claim
41 words
A printed circuit board, comprising: a first region with a substantially predetermined and substantially uniform first rigidity; and a second region with a substantially predetermined and substantially uniform second rigidity; and said second rigidity being measurably different from said first rigidity.
Claim 22
Dependent Claim
41 words
A printed circuit board, comprising: a first region with a substantially predetermined and substantially uniform first rigidity; and a second region with a substantially predetermined and substantially uniform second rigidity; and said second rigidity being measurably different from said first rigidity.
References Cited (Backward Citations)
No citation records indexed.
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