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EP0309986A1 Expired / Lapsed EP ⏱️ 0.0 years remaining

Electronic control apparatus for use in automobile

Assignee: Hitachi Ltd
•
Filing: 1988-09-27
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Granted: —
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Expires: 2008-09-27
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Abstract

Abstract An electronic control apparatus for use in an automobile has a base (14) of a good thermal conductivity having one side disposed in contact with engine cooling water. Semiconductor devices (8, 9, 10, 22, 90) are disposed on the other side of the base so that the semi­conductor devices are maintained at the temperature of the engine cooling water, whereby the influence of high ambient air temperature to the semiconductor devices is reduced.

Inventors

  • 👤 Yuichi Kashimura
  • 👤 Shizuhisa Watanabe
  • 👤 Seiji Suda

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-02 23:32
CPC Classifications
B; B60; B60R; B60R16/00; F; F02; F02D; F02D41/00; F02D41/30; F02D41/3005; H; H05; H05K; H05K7/00; H05K7/20; H05K7/20845; H05K7/20872; F01; F01P; F01P2050/00; F01P2050/30; F02D2400/00; F02D2400/18

Claims Analysis

Total Claims: 8
Claim 1
Independent Claim 74 words
An electronic control apparatus for use in an automobile, coprising: a) a base (14) having one side in which a passage (15) for circulation of an engine cooling water is formed and the other side on which semiconductor devices (8, 9, 10, 22, 90) are disposed, said base body being made of a material having a good thermal conduc­tivity; and b) an enclosure (23) fixed to said base to hermetically cover said semiconductor devices.
Claim 2
Dependent Claim 74 words
An electronic control apparatus for use in an automobile, coprising: a) a base (14) having one side in which a passage (15) for circulation of an engine cooling water is formed and the other side on which semiconductor devices (8, 9, 10, 22, 90) are disposed, said base body being made of a material having a good thermal conduc­tivity; and b) an enclosure (23) fixed to said base to hermetically cover said semiconductor devices.
Claim 3
Dependent Claim 44 words
An electronic control apparatus according to claim 1, wherein a flow control valve (28) is disposed at the inlet side of said passage, said flow control valve being arranged to open when the temperature of said engine cooling water has reached a predetermined tempera­ture.
Claim 4
Dependent Claim 18 words
An electronic control apparatus according to claim 1, wherein a temperature sensor (6) is disposed on said base.
Claim 5
Dependent Claim 18 words
An electronic control apparatus according to claim 1, wherein a knock sensor (7) is disposed on said base.
Claim 6
Dependent Claim 58 words
An electronic control apparatus according to claim 1, wherein a board (20) for carrying said semi­conductor devices is disposed between said base and said enclosure, input and output units (8, 10) being disposed between said board and said base, and an arithmetic unit (9) and a data storage device (90) being disposed between said board and said enclosure.
Claim 7
Dependent Claim 113 words
An electronic control apparatus for use in an automobile, comprising: a) a first passage for cooling water formed in a wall of an intake manifold (29) of an engine and having an opening (32) which opens to atmosphere; b) a base (14) mounted on said intake manifold so as to cover said oening of said first passage, said base having one side in which a second passage (15) for circulation of the cooling water is formed and the other side on which semiconductor devices are disposed, said base being made of a material having a good thermal conductivity; and c) an enclosure (23) fixed to said base to hermetically cover said semiconductor devices.
Claim 8
Dependent Claim 113 words
An electronic control apparatus for use in an automobile, comprising: a) a first passage for cooling water formed in a wall of an intake manifold (29) of an engine and having an opening (32) which opens to atmosphere; b) a base (14) mounted on said intake manifold so as to cover said oening of said first passage, said base having one side in which a second passage (15) for circulation of the cooling water is formed and the other side on which semiconductor devices are disposed, said base being made of a material having a good thermal conductivity; and c) an enclosure (23) fixed to said base to hermetically cover said semiconductor devices.

References Cited (Backward Citations)

US3965971A Cited
DE3026802A1 Cited
EP0084179A2 Cited
EP0225108A1 Cited
GB2183304A Cited

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