EP0346525A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Multilayer electronic circuit and method of manufacture
Assignee: Sheldahl Inc
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Filing: 1988-11-05
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Granted: —
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Expires: 2008-11-05
Abstract
Abstract A multilayer electronic circuit comprising at least three electronic circuit layers electrically interconnected by means of at least one interposed connecting layer which is conductive only in the Z-axis. Desirably at least four circuit layers are provided in two circuit layer pairs. Each pair comprises an insulating layer having opposing surfaces and having a circuit pattern on each of the opposing surfaces of the insulating layer. The patterns in each pair are connected by means of conductors passing through the insulating layer. The thus formed pairs are connected to each other the connecting layer interposed between one such pattern frome each of said pairs. The connecting layer comprises an electrically insulating resin containing electrically conductive particles. The quantity of the particles is statistically selected so as to be sufficiently dispersed to prevent electrical conduction along the X and Y axes of the connecting layer and sufficiently concentrated and of a size to insure electrical contact through the Z-axis of the connecting layer between conductive portions of the circuit layers which are in contact with the connecting layer and directly opposite each other through the connecting layer. The invention further includes a method for making the multilayer electronic circuit.
Inventors
- 👤 Kenneth B. Dr. Gilleo
- 👤 Deanna M. Dowdle
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-29 00:47
CPC Classifications
H; H05; H05K; H05K3/00; H05K3/46; H05K3/4611; H05K3/4614; H05K3/462; H05K1/00; H05K3/30; H05K3/32; H05K3/321; H05K3/323; H05K2201/00; H05K2201/02; H05K2201/0203; H05K2201/0206; H05K2201/0233; H05K2201/0263; H05K2201/0266; H05K2201/09; H05K2201/09209; H05K2201/095; H05K2201/09536; H05K2201/096; H05K2203/00; H05K2203/04; H05K2203/0425; H05K2203/06; H05K2203/061; H05K2203/15; H05K2203/1572; H05K3/22; H05K3/28; H05K3/4623; H10; H10W; H10W72/00; H10W72/30; H10W72/321; H10W72/325; H10W72/351; H10W72/352
Claims Analysis
Total Claims: 26
Claim 1
Independent Claim
29 words
A multilayer electronic circuit comprising at least three electronic circuit layers electrically interconnected by means of at least one interposed connecting layer which is conductive only in the Z-axis.
Claim 2
Dependent Claim
29 words
A multilayer electronic circuit comprising at least three electronic circuit layers electrically interconnected by means of at least one interposed connecting layer which is conductive only in the Z-axis.
Claim 3
Dependent Claim
80 words
The multilayer electronic circuit of claim 1 wherein at least four circuit layers are provided in two circuit layer pairs each pair comprising an insulating layer having opposing surfaces and having a circuit pattern on each of the opposing surfaces of the insulating layer, which patterns in each pair are connected by means of conductors passing through the insulating layer, said pairs being connected by means of said connecting layer interposed between one such pattern from each of said pairs.
Claim 4
Dependent Claim
89 words
The multilayer circuit of claim 1 wherein the connecting layer comprises an electrically insulating material containing electrically conductive particles, the quantity of said particles being statistically selected so as to be sufficiently dispersed to prevent electrical conduction along the X and Y axes of the connecting layer and sufficiently concentrated and of a size to insure electrical contact through the Z-axis of the connecting layer between conductive portions of said circuit layers which are in contact with the connecting layer and directly opposite each other through the connecting layer.
Claim 5
Dependent Claim
14 words
The multilayer electronic circuit of claim 3 wherein the insulating material is a resin.
Claim 6
Dependent Claim
56 words
The multilayer electronic circuit of claim 2 wherein at least three circuit layer pairs are provided wherein at least one inner circuit layer pair is sandwiched between two outer circuit layer pairs, said pairs being interconnected by means of at least two connecting layers to form a multilayer circuit having at least six electronic circuit layers.
Claim 7
Dependent Claim
37 words
The multilayer electronic circuit of claim 3 wherein the electrically conductive particles are essentially spherical and have diameters at least as large as and within ten percent of the thickness of the connecting layer between conductive portions.
Claim 8
Dependent Claim
13 words
The circuit of claim 3 wherein the particles are a fusible metallic substance.
Claim 9
Dependent Claim
14 words
The circuit of claim 7 wherein the metallic substance is a low temperature solder.
Claim 10
Dependent Claim
18 words
The multilayer electronic circuit of claim 1 wherein at least some of the circuit layers include semiconductor components.
Claim 11
Dependent Claim
18 words
The multilayer electronic circuit of claim 1 wherein at least some of the circuit layers include passive components.
Claim 12
Dependent Claim
29 words
The multilayer circuit of claim 3 wherein the circuit layers are covered by an insulating film mask, except at conductive portions where contact through the connecting layer is desired.
Claim 13
Dependent Claim
39 words
The multilayer circuit of claim 5 wherein the insulating layer of the inner circuit layer pair is made from a temperature sensitive dielectric, and the insulating layers of the outer circuit layer pairs are made from heat resistant dielectric.
Claim 14
Independent Claim
161 words
A method for making a multilayer electronic circuit comprising: a) making circuit layer pairs each pair comprising an insulating layer having opposing surfaces and having a circuit pattern on each of the opposing surfaces of the insulating layer, which patterns in each pair are connected by means of conductors passing through the insulating layer; and b) connecting at least two of such pairs by interposing an adhesive connecting layer between one such pattern from each of said pairs, said adhesive connecting layer comprising an electrically insulating resin containing electrically conductive particles, the quantity of said particles being statistically selected so as to be sufficiently dispersed to prevent electrical conduction along the X and Y axes of the connecting layer and sufficiently concentrated and of a size to insure electrical contact through the Z-axis of the connecting layer between conductive portions of the circuit patterns which are in contact with the connecting layer and directly opposite each other through the connecting layer.
Claim 15
Independent Claim
161 words
A method for making a multilayer electronic circuit comprising: a) making circuit layer pairs each pair comprising an insulating layer having opposing surfaces and having a circuit pattern on each of the opposing surfaces of the insulating layer, which patterns in each pair are connected by means of conductors passing through the insulating layer; and b) connecting at least two of such pairs by interposing an adhesive connecting layer between one such pattern from each of said pairs, said adhesive connecting layer comprising an electrically insulating resin containing electrically conductive particles, the quantity of said particles being statistically selected so as to be sufficiently dispersed to prevent electrical conduction along the X and Y axes of the connecting layer and sufficiently concentrated and of a size to insure electrical contact through the Z-axis of the connecting layer between conductive portions of the circuit patterns which are in contact with the connecting layer and directly opposite each other through the connecting layer.
Claim 16
Dependent Claim
30 words
The method of claim 13 wherein subsequent to connecting said pairs by interposing said adhesive connecting layer, the resulting connected pairs are pressed to insure good lamination and electrical contact.
Claim 17
Dependent Claim
23 words
The method of claim 13 wherein subsequent to connecting said pairs by interposing said adhesive connecting layer, the adhesive connecting layer is cured.
Claim 18
Dependent Claim
23 words
The method of claim 14 wherein subsequent to connecting said pairs by interposing said adhesive connecting layer, the adhesive connecting layer is cured.
Claim 19
Dependent Claim
39 words
The method of claim 13 wherein prior to connecting with the connecting layer, at least one of the circuit patterns of each pair is covered with an insulating mask, except at the conductive portion areas of desired electrical contact.
Claim 20
Dependent Claim
42 words
The method of claim 17 wherein subsequent to covering a circuit pattern with an insulating mask, the exposed locations of desired electrical contact are treated with an electrically conductive material to elevate such locations to at least the surface of the mask.
Claim 21
Dependent Claim
35 words
The method of claim 13 wherein the electrically conductive particles are essentially spherical and have diameters at least as large as and within ten percent of the thickness of the connecting layer between conductive portions.
Claim 22
Dependent Claim
47 words
The method of claim 13 wherein the particles are a fusible metallic substance and subsequent to connecting by interposing the adhesive connecting layer the particles are fused to form a positive connection to said conductive portions of the circuit patterns in contact with the adhesive connecting layer.
Claim 23
Dependent Claim
14 words
The method of claim 20 wherein the metallic substance is a low temperature solder.
Claim 24
Dependent Claim
16 words
The method of claim 13 wherein at least some of the circuit layers include semiconductor components.
Claim 25
Dependent Claim
15 words
The method of claim 13 wherein the conductive particles are composed of intrinsically conductive polymers.
Claim 26
Dependent Claim
15 words
The method of claim 13 wherein the circuit patterns are made from polymer thick film.
References Cited (Backward Citations)
No citation records indexed.
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