Plastic encapsulated package for integrated circuit die

Claim 2

A high performance plastic-encapsulated inte­grated circuit package having both im­proved heat dissipation and low ground noise com­prising one or more separate ground and/or power planes adjacent signal lines electrically connected to an integrated circuit die comprising: (a) an electrically conductive heat sink member capable of dissipating heat and which may also may function as a ground or power plane; (b) an integrated circuit die centrally and insulatively bonded to one surface of said heat sink member; (c) a peripheral printed circuit board, at least a portion of a first surface of which is bonded to said heat sink surface to surround said centrally mounted die on said heat sink surface and a second surface on which is formed one or more electrically conductive members; (d) a lead frame assembly insulatively bonded to said second surface of said printed circuit board comprising one or more leads electrical­ly connected at their inner ends respectively to terminal pads on said integrated circuit die, to said one or more electrically conduc­tive members on said second face of said printed circuit board, and to said electrical­ly conductive heat sink member; and (e) a plastic encapsulating material which completely surrounds said integrated circuit die, said heat sink, said printed circuit board and all of said lead frame except for outer ends of said leads thereon.

Claim 3

The high performance plastic-encapsulated inte­grated circuit package of claim 1 wherein said first face of said printed circuit board is also provided with one or more electrically conductive members, said electrically conducted heat sink is insulatively mounted to said first face of said printed circuit board, and one or more leads on said lead frame are also electrically connected to said one or more electrically conductive members on said first face of said printed circuit board.

Claim 4

The high performance plastic-encapsulated inte­grated circuit package of claim 2 wherein electri­cally conductive terminal pads are also formed on said second surface of said printed circuit board and electrically conductive vias are formed beneath said terminal pads extending through said printed circuit board to make electrical contact with said one or more electrically conductive members on said first surface of said printed circuit board.

Claim 5

The high performance plastic-encapsulated inte­grated circuit package of claim 3 wherein lead wires respectively electrically connect two or more of said die terminal pads with said heat sink when said heat sink also functions as a power or ground bus.

Claim 6

The high performance plastic-encapsulated inte­grated circuit package of claim 2 wherein said heat sink member is generally rectangular, said inte­grated circuit die centrally mounted to one surface of said heat sink member is generally rectangular, and said peripheral printed circuit board is also generally rectangular with a generally rectangular opening centrally formed therein which is larger than said rectangular integrated circuit die to thereby expose a portion of said one surface of said heat sink between said printed circuit board and said integrated circuit die when both said printed circuit board and said integrated circuit die are centrally mounted to said rectangular heat sink.

Claim 7

The high performance plastic-encapsulated inte­grated circuit package of claim 5 wherein the re­spective undersurfaces of said die and said printed circuit board are both bonded coplanarly to the upper surface of said heat sink whereby said printed circuit board surrounds said die without interfering with the heat transfer from said die to said heat sink.

Claim 8

The high performance plastic-encapsulated inte­grated circuit package of claim 1 wherein said second surface of said printed circuit board fur­ther includes terminal pads electrically connected respectively to one or more of said terminal pads on said integrated circuit die and to one or more of said leads on said lead frame; and said printed circuit board further comprises one or more vias which electrically connect said terminal pads on said second surface thereof respectively to said electrically conductive members on said first sur­face thereof and to said electrically conductive heat sink member.

Claim 9

A high performance plastic-encapsulated integrated circuit package having both improved heat dissipation and low ground noise comprising one or more separate ground and/or power planes adjacent signal lines electrically connected to an integrated circuit die comprising: (a) an electrically conductive rectangular heat sink member capable of dissipating heat and which may also may function as a ground or power plane; (b) a rectangular integrated circuit die centrally and insulatively mounted to one surface of said heat sink member and having die terminal pads formed thereon; (c) a generally rectangular peripheral printed circuit board bonded to said heat sink member comprising: (i) a first surface having one or more electrically conductive planar members formed thereon, said first surface being insulatively bonded to said electrically conductive heat sink member; (ii) a second surface having one or more electrically conductive planar members formed thereon and one or more terminal pads also formed thereon and electrically spaced from said electrically conductive planar members; (iii) electrically conductive vias formed therein to respectively electri­cally connect one or more of said termin­al pads on said second surface to one or more of said electrically conductive planar members on said first surface of said printed circuit board and to said electrically conductive heat sink member to which said printed circuit board is bonded; (iv) a generally rectangular opening centrally formed therein which is larger than said rectangular integrated circuit die, whereby said rectangular printed circuit board generally surrounds said centrally mounted die on said heat sink surface; (d) a lead frame assembly insulatively bonded to said second surface of said printed circuit board comprising one or more leads electrical­ly connected at their inner ends respectively to said terminal pads on said integrated cir­cuit die, to said one or more electrically conductive members on said second surface of said printed circuit board, and to said one or more electrically conductive members on said first surface of said printed circuit board and said electrically conductive heat sink member through said terminal pads on said second surface of said printed circuit board and said vias; and (e) a plastic encapsulating material which completely surrounds said integrated circuit die, said heat sink, said printed circuit board, and all of said lead frame except for outer ends of said leads thereon.

Claim 10

A high performance plastic-encapsulated integrated circuit package having both improved heat dissipation and low ground noise comprising one or more separate ground and/or power planes adjacent signal lines electrically connected to an integrated circuit die comprising: (a) an electrically conductive rectangular heat sink member capable of dissipating heat and which may also may function as a ground or power plane; (b) a rectangular integrated circuit die centrally and insulatively mounted to one surface of said heat sink member and having die terminal pads formed thereon; (c) a generally rectangular peripheral printed circuit board bonded to said heat sink member comprising: (i) a first surface having one or more electrically conductive planar members formed thereon, said first surface being insulatively bonded to said electrically conductive heat sink member; (ii) a second surface having one or more electrically conductive planar members formed thereon and one or more terminal pads also formed thereon and electrically spaced from said electrically conductive planar members; (iii) electrically conductive vias formed therein to respectively electri­cally connect one or more of said termin­al pads on said second surface to one or more of said electrically conductive planar members on said first surface of said printed circuit board and to said electrically conductive heat sink member to which said printed circuit board is bonded; (iv) a generally rectangular opening centrally formed therein which is larger than said rectangular integrated circuit die, whereby said rectangular printed circuit board generally surrounds said centrally mounted die on said heat sink surface; (d) a lead frame assembly insulatively bonded to said second surface of said printed circuit board comprising one or more leads electrical­ly connected at their inner ends respectively to said terminal pads on said integrated cir­cuit die, to said one or more electrically conductive members on said second surface of said printed circuit board, and to said one or more electrically conductive members on said first surface of said printed circuit board and said electrically conductive heat sink member through said terminal pads on said second surface of said printed circuit board and said vias; and (e) a plastic encapsulating material which completely surrounds said integrated circuit die, said heat sink, said printed circuit board, and all of said lead frame except for outer ends of said leads thereon.

Claim 11

The high performance plastic-encapsulated integrated circuit package of claim 3 or claim 8 wherein one or more of said electrically conductive vias extending through said printed circuit board make electrical contact with said metal heat sink to which said printed circuit board is bonded to permit said printed circuit board to function as a power or ground bus for said package.

Claim 12

The high performance plastic-encapsulated integrated circuit package of claim 3 or claim 8 wherein lead wires interconnect said leads on said lead frame with said terminal pads on said second surface of said printed circuit board and lead wires also interconnect said printed circuit board terminal pads with terminal pads on said die.

Claim 13

The high performance plastic-encapsulated integrated circuit package of claim 3 or claim 8 wherein lead wires connect said leads on said lead frame with said one or more electrically conductive members on said second surface of said printed circuit board and lead wires also interconnect said one or more electrically conductive members on said second surface of said printed circuit board with one or more terminal pads on said die.

Claim 14

The high performance plastic-encapsulated integrated circuit package of claim 3 or claim 8 wherein at least one of said one or more electrically conductive members on said second surface of said printed circuit board functions as a power or ground bus and two or more of said die terminal pads are electrically connected to said power or ground bus.

Claim 15

The high performance plastic-encapsulated integrated circuit package of claim 3 or claim 8 wherein at least one of said one or more electrically conductive members on said first surface of said printed cir­cuit board functions as a power or ground bus and two or more of said die terminal pads are electri­cally connected through one or more of said termin­al pads on said second surface of said printed circuit board and said vias thereunder to said power or ground bus.

Claim 16

A high performance plastic-encapsulated integrated circuit package having both improved heat dissipation and low ground noise comprising one or more separate ground and/or power planes adjacent signal lines electrically connected to an integrated circuit die comprising: (a) an electrically conductive rectangular heat sink member capable of dissipating heat and which also functions as a ground or power plane; (b) a rectangular integrated circuit die centrally and insulatively mounted to one surface of said heat sink member and having die terminal pads formed thereon; (c) a generally rectangular peripheral printed circuit board having a lower surface which is bonded to said heat sink member co­planarly with said die and surrounding said die, said printed circuit board further com­prising: (i) a first surface having one or more electrically conductive planar members formed thereon comprising at least one power or ground bus electrically con­nected to two or more of said die termin­al pads, said first surface being insula­tively bonded to said electrically con­ductive heat sink member; (ii) a second surface having one or more electrically conductive planar members formed thereon comprising at least one power or ground bus electrically con­nected to two or more of said die termin­al pads, and one or more terminal pads also formed thereon and electrically spaced from said electrically conductive planar members; (iii) electrically conductive vias formed therein to respectively electri­cally connect one or more of said termin­al pads on said second surface to one or more of said electrically conductive planar members on said first surface of said printed circuit board and to said electrically conductive heat sink member to which said printed circuit board is bonded; (iv) a generally rectangular opening centrally formed therein which is larger than said rectangular integrated circuit die, whereby said rectangular printed circuit board generally surrounds said centrally mounted die on said heat sink surface; (d) a lead frame assembly insulatively bonded to said second surface of said printed circuit board comprising one or more leads electrical­ly connected at their inner ends respectively to said terminal pads on said integrated cir­cuit die, to said one or more electrically conductive members on said second surface of said printed circuit board, and to said one or more electrically conductive members on said first surface of said printed circuit board and said electrically conductive heat sink member through said terminal pads on said second surface of said printed circuit board and said vias; and (e) a plastic encapsulating material which completely surrounds said integrated circuit die, said heat sink, said printed circuit board, and all of said lead frame except for outer ends of said leads thereon.

Claim 17

A high performance plastic-encapsulated integrated circuit package having both improved heat dissipation and low ground noise comprising one or more separate ground and/or power planes adjacent signal lines electrically connected to an integrated circuit die comprising: (a) an electrically conductive rectangular heat sink member capable of dissipating heat and which also functions as a ground or power plane; (b) a rectangular integrated circuit die centrally and insulatively mounted to one surface of said heat sink member and having die terminal pads formed thereon; (c) a generally rectangular peripheral printed circuit board having a lower surface which is bonded to said heat sink member co­planarly with said die and surrounding said die, said printed circuit board further com­prising: (i) a first surface having one or more electrically conductive planar members formed thereon comprising at least one power or ground bus electrically con­nected to two or more of said die termin­al pads, said first surface being insula­tively bonded to said electrically con­ductive heat sink member; (ii) a second surface having one or more electrically conductive planar members formed thereon comprising at least one power or ground bus electrically con­nected to two or more of said die termin­al pads, and one or more terminal pads also formed thereon and electrically spaced from said electrically conductive planar members; (iii) electrically conductive vias formed therein to respectively electri­cally connect one or more of said termin­al pads on said second surface to one or more of said electrically conductive planar members on said first surface of said printed circuit board and to said electrically conductive heat sink member to which said printed circuit board is bonded; (iv) a generally rectangular opening centrally formed therein which is larger than said rectangular integrated circuit die, whereby said rectangular printed circuit board generally surrounds said centrally mounted die on said heat sink surface; (d) a lead frame assembly insulatively bonded to said second surface of said printed circuit board comprising one or more leads electrical­ly connected at their inner ends respectively to said terminal pads on said integrated cir­cuit die, to said one or more electrically conductive members on said second surface of said printed circuit board, and to said one or more electrically conductive members on said first surface of said printed circuit board and said electrically conductive heat sink member through said terminal pads on said second surface of said printed circuit board and said vias; and (e) a plastic encapsulating material which completely surrounds said integrated circuit die, said heat sink, said printed circuit board, and all of said lead frame except for outer ends of said leads thereon.