Multilayer circuit board and method of making it

Abstract

Abstract In the case of a multilayer circuit board having flexible regions (8), for which rigid board regions (3) are connected to a flexible base (1), a polyether ketone film, in particular a polyether ether ketone film, is used as the flexible base (1) and the rigid board regions (3) are adhesively bonded to the film (1). In the case of a method of making such a multilayer circuit board, the polyether ketone film or polyether ether ketone film is superficially modified by chemical etching, flaming, corona discharge or plasma etching in those regions (7) which are subsequently to be permanently bonded to the rigid board regions (3), to increase their surface tension, and is subsequently adhesively bonded to the rigid circuit board material (3), in particular of a prepreg (4). <IMAGE>

Inventors

• 👤 Robert Dipl.-Ing. Vodiunig
• 👤 Johannes Dipl.-Ing. Stahr

Bibliographic Details