Claims Analysis
Total Claims: 12
Claim 1
Independent Claim
80 words
A monolithic laser diode array comprising: a monolithic substrate having upper and lower major surfaces and at least one groove formed in said upper major surface along a length of said substrate, said at least one groove having side walls formed vertically in said substrate; a metallization layer disposed along said side walls of said at least one groove to form at least one metallized groove; and a plurality of laser diodes disposed in said at least one metallized groove.
Claim 2
Dependent Claim
112 words
A monolithic laser diode array comprising: a monolithic substrate having upper and lower major surfaces and at least one groove formed in said upper major surface along a length of said substrate, wherein said substrate is formed of such a material and has such a thickness, and said at least one groove is formed to such a depth as to permit flexure of said substrate through provision of force in a direction from a bottom of said substrate; a metallization layer disposed along side walls of said at least one groove to form at least one metallized groove; and a plurality of laser diodes disposed in said at least one metallized groove.
Claim 3
Dependent Claim
51 words
An array as claimed in claim 1 or claim 2, wherein a plurality of grooves are formed in said upper major surface, such that said metallization layer forms a plurality of metallized grooves, and said plurality of laser diodes are disposed in each of said metallized grooves, forming a two-dimensional array.
Claim 4
Dependent Claim
25 words
An array as claimed in claim 1 or claim 2, wherein said substrate comprises a material selected from the group consisting of BeO and AlN.
Claim 5
Dependent Claim
27 words
An array as claimed in claim 1 or claim 2, wherein said metallization layer comprises a metal selected from the group consisting of Au, Ni, and Cr.
Claim 6
Dependent Claim
43 words
An array as claimed in claim 1 or claim 2, further comprising a soldering layer for attaching said plurality of laser diodes within said metallized groove, said soldering layer comprising a solder selected from the group consisting of Au/Si, Au/Sn, In, and Pb.
Claim 7
Dependent Claim
51 words
An array as claimed in claim 1 or claim 2, further comprising: a heat spreader mounted on said lower major surface of said substrate; a heat sink attached to an opposite side of said heat spreader from said substrate; and driving circuitry, connected to said substrate, for driving said laser diodes.
Claim 8
Dependent Claim
24 words
An array as claimed in claim 7, wherein said heat spreader is attached to said lower surface of said substrate via a eutectic bond.
Claim 9
Independent Claim
61 words
A method of forming monolithic laser diode arrays, said method comprising: providing a monolithic substrate; forming at least one groove in a major surface of said substrate; depositing a metallization layer along side walls of said at least one groove to form at least one metallization groove; and setting a plurality of laser diodes in said at least one metallization groove.
Claim 10
Dependent Claim
78 words
A method as claimed in claim 9, wherein: said forming step comprises the step of forming a plurality of grooves in said substrate; said depositing step comprises the step of depositing said metallization layer along side walls of each of said plurality of grooves to form a plurality of metallization grooves; and said setting step comprises the step of setting said plurality of laser diodes in each of said plurality of metallization grooves to form a two-dimensional array.
Claim 11
Dependent Claim
74 words
A method as claimed in claim 10, wherein said setting step comprises the steps of: flexing said substrate by applying a force from a side of said substrate opposite a side in which said plurality of grooves are formed, to separate said side walls of said grooves; placing said plurality of laser diodes in said plurality of grooves; and terminating application of said force so that said side walls return to their original positions.
Claim 12
Dependent Claim
36 words
A method as claimed in claim 9, wherein said setting step includes the step of applying adhesive, comprising a thermally and electrically conductive epoxy solder, along said side walls to secure said plurality of laser diodes.