EP0444820A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
MMIC package and connection
Assignee: Raytheon Co
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Filing: 1991-02-20
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Granted: —
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Expires: 2011-02-20
Abstract
Abstract A package for electronic components, especially MMIC components, is constructed from layers (12,14,16,18,20)) of ceramic cofired to form an annular piece. Metal pieces (10,22,24) are brazed onto the top and bottom of the annular piece to hermetically seal the package. Certain of the ceramic pieces (12,14,16,18,20) are coated with patterns of conductive material before cofiring. The conductive material forms DC power distribution lines (32A, 32B) to electronic components (28A, 28B) within the package and low loss RF feedthroughs (50A, 50B) into the package. <IMAGE>
Inventors
- 👤 George R. Lehman
- 👤 Steven W. Miller
- 👤 Stacey M. Bilski
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-31 17:39
CPC Classifications
H; H10; H10W; H10W44/00; H10W44/20; H10W42/00; H10W42/20; H10W42/281; H10W42/287; H10W72/00; H10W72/01; H10W72/016; H10W72/071; H10W72/0711; H10W72/07125; H10W72/072; H10W72/07231; H10W72/07232; H10W72/07236; H10W72/20; H10W72/241; H10W72/50; H10W72/551; H10W72/552; H10W72/5522
Claims Analysis
Total Claims: 17
Claim 1
Independent Claim
65 words
A package formed from a plurality of layers with at least two of the plurality of layers having openings formed therethrough which align to form a cavity within the package, and a first one of said layers having an opening having a portion extending beyond the portion of a second of said layers defining the cavity, said extending portion having formed thereon a conductive trace.
Claim 2
Dependent Claim
36 words
The package of Claim 1 wherein the conductive trace is formed from a first material with a first conductance coated by a material with a second conductance, the second conductance being higher than the first conductance.
Claim 3
Dependent Claim
11 words
The package of Claim 2 wherein the first material comprises tungsten.
Claim 4
Dependent Claim
11 words
The package of Claim 3 wherein the second material comprises gold.
Claim 5
Dependent Claim
17 words
The package of Claim 4 wherein a portion of the plurality of layers are formed from ceramic.
Claim 6
Dependent Claim
11 words
The package of Claim 5 wherein the ceramic layers comprise alumina.
Claim 7
Dependent Claim
16 words
The package of Claim 1 wherein the trace has a length in excess of one inch.
Claim 8
Dependent Claim
28 words
The package of Claim 1 wherein the cavity is adapted to receive an MMIC chip and the trace is adapted to carry at least two amps of current.
Claim 9
Dependent Claim
20 words
The package of Claim 8 wherein the package has a dimension of approximately one-half inch by at least one inch.
Claim 10
Dependent Claim
15 words
The package of Claim 9 adapted to hermetically seal an MMIC chip inside the cavity.
Claim 11
Dependent Claim
12 words
The package of Claim 1 containing a MMIC chip inside the cavity.
Claim 12
Dependent Claim
16 words
The package of Claim 11 additionally comprising bond wires from the trace to the MMIC chip.
Claim 13
Dependent Claim
16 words
The package of Claim 12 wherein the bond wires provide DC voltage to the MMIC chip.
Claim 14
Dependent Claim
17 words
The package of Claim 1 wherein the trace extends under a second portion of said second layer.
Claim 15
Dependent Claim
16 words
The package of Claim 14 wherein the second portion of said second layer contains a hole.
Claim 16
Dependent Claim
14 words
The package of Claim 15 wherein said hole is filled with a conducting material.
Claim 17
Dependent Claim
113 words
In a package for a circuit operating on an RF signal, an RF connector comprising: a) a first layer, said first layer having a surface region of conductive material; b) a second layer having a conductive trace disposed on a surface portion, said conductive trace having a wide portion and a narrow portion, said second layer mounted above the first layer such that the conductive trace is above the conductive surface region of the first layer; and c) a third layer having a conductive surface region, said third layer mounted above the second layer such that the conductive surface region is above the narrow portion of the conductive trace on the second layer.
References Cited (Backward Citations)
No citation records indexed.
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