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EP0476282A2 Expired / Lapsed EP ⏱️ 0.0 years remaining

Improvements in or relating to integrated circuits

Assignee: Texas Instruments Inc
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Filing: 1991-07-31
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Granted: —
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Expires: 2011-07-31
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Abstract

Abstract A configuration or option selection circuit and method for a semiconductor device is disclosed. the circuit has a bond pad which is selectively coupled t a first voltage and coupled to a second voltage. the first voltage corresponds to a first option and the second voltage to a second option. If the bond pad is not connected to the first option, the integrated circuit device operates in the second option; while if the bond pad is connected to the first voltage the integrated circuit device operates in the first option. The concept of the invention is incorporated into a semiconductor memory device that is bond programmable to select different options. the memory device has an array of memory cells and support circuitry to read information from the memory cells and to write information to the memory cells. It has option circuitry, responsive to voltage, to operate the array and support circuitry in different modes. A bond pad is connected to the option circuitry, coupled to a first voltage, and bondable to a second voltage. The option circuitry operates the array and support circuitry in one mode when the bond pad is not bonded to the second voltage. It operates the array and support circuitry in another mode when the bond pad is bonded to the first voltage.

Inventors

  • 👤 Hugh P. Mcadams
  • 👤 Wah K. Loh

Bibliographic Details

Application Number —
Jurisdiction EP
Data Source google_patents
Last Synchronized 2026-11-04 09:43
CPC Classifications
G; G11; G11C; G11C11/00; G11C11/21; G11C11/34; G11C11/40; G11C11/401; G11C11/406; G11C5/00; G11C5/14

Claims Analysis

Total Claims: 13
Claim 1
Independent Claim 76 words
An integrated circuit device, comprising: a bond pad selectively connectable to a first voltage source corresponding to a first option of the device and coupled to a second voltage source corresponding to a second option of the device, wherein the device operates in the second option when the bond pad is unconnected to the first voltage source and the device operates in the first option when the bond pad is connected to the first voltage source.
Claim 2
Dependent Claim 22 words
An integrated circuit device as claimed in Claim 1 and wherein a transistor couples the bond pad to the second voltage source.
Claim 3
Dependent Claim 39 words
An integrated circuit device as claimed in any preceding claim and including option circuitry, responsive to voltage, to operate the device in a first mode corresponding to a first option and a second mode corresponding to a second option.
Claim 4
Dependent Claim 35 words
An integrated circuit device as claimed in claim 3 and further comprising: a latch having an input coupled to the bond pad and an output for transmitting a signal in dependence upon bond pad connection.
Claim 5
Dependent Claim 22 words
An integrated circuit device as claimed in any preceding claim and wherein said first and second options are options of semiconductor memory.
Claim 6
Dependent Claim 35 words
An integrated circuit device as claimed in claim 5 and wherein the first option configures the memory device as a X 1 memory and the second option configures the memory as a X 4 memory.
Claim 7
Dependent Claim 37 words
An integrated circuit devices as claimed in Claim 5 and wherein the first option configures the memory device to have a 4,096 cycle refresh, and the second option configures the device to have a 2,048 cycle refresh.
Claim 8
Dependent Claim 94 words
An integrated circuit device as claimed in any of claims 5 to 7 in that they depend from claim 4 and including an array of memory cells; support circuitry to read information from the memory cells and write information to the memory cells; wherein the option circuitry operates the array and support circuitry in the first mode when the bond pad is unconnected to the first voltage source and wherein the option circuitry operates the array and support circuitry in the second mode when the bond pad is connected to the first voltage connected.
Claim 9
Dependent Claim 26 words
An integrated circuit device as claimed in any preceding claim wherein at least one of said first and second voltage sources is generated within the circuit.
Claim 10
Independent Claim 47 words
A method for option selection for an integrated circuit device; comprising the steps of: coupling a bond pad to a first voltage to operate the device in a first mode; and coupling the bond pad to a second voltage to operate the device in a second mode.
Claim 11
Dependent Claim 19 words
A method as claimed in claim 9 and wherein said coupling is by means of bonding the bond pad.
Claim 12
Dependent Claim 28 words
A method as claimed in claim 10 and wherein said coupling is by means of a scheduled bonding step in production of a device of the second option.
Claim 13
Dependent Claim 24 words
A method as claimed in claim 12 and wherein said scheduled bonding step is omitted in production of a device of the first option.

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