Claims Analysis
Total Claims: 22
Claim 1
Independent Claim
24 words
A negative-acting electrodepositable radiation sensitive composition, comprising a polymer and a radiation sensitive component, the polymer comprising cataphoretic carrier groups and anaphoretic carrier groups.
Claim 2
Dependent Claim
34 words
The composition of claim 1 where the anaphoretic carrier groups are carboxylate groups, and the cataphoretic carrier groups are selected from the group consisting of quaternary ammonium groups, sulfonium groups, sulfoxonium groups, and amines.
Claim 3
Dependent Claim
15 words
The composition of claim 1 where the polymer comprises one or more ethylenic unsaturated groups.
Claim 4
Dependent Claim
13 words
The composition of claim 1 further comprising a compound that comprises unsaturated groups.
Claim 5
Dependent Claim
24 words
The composition of claim 1 where the polymer is selected from the group of vinyl polymers, epoxy polymers, polyurethanes, polyesters, polyamides, and copolymers thereof.
Claim 6
Dependent Claim
15 words
The composition of claim 1 where the composition is formulated as a liquid coating composition.
Claim 7
Dependent Claim
14 words
The composition of claim 1 in the form of a a dry film resist.
Claim 8
Independent Claim
66 words
A method for forming a relief image on a conductive surface of a substrate, comprising: (a) electrophoretically applying a layer of a negative-acting radiation sensitive composition on the conductive surface, the composition comprising a polymer and a radiation sensitive component, the polymer comprising cataphoretic carrier groups and anaphoretic carrier groups; and (b) exposing and developing the composition layer on the surface to yield a relief image.
Claim 9
Dependent Claim
15 words
The method of claim 8 where the composition is applied cataphoretically to the conductive surface.
Claim 10
Dependent Claim
15 words
The method of claim 8 where the composition is applied anaphoretically to the conductive surface.
Claim 11
Dependent Claim
16 words
The method of claim 9 where the exposed composition layer is developed with an acidic developer.
Claim 12
Dependent Claim
23 words
The method of claim 11 where the composition layer is developed with an acidic developer solution that comprises one or more acidic surfactants.
Claim 13
Dependent Claim
16 words
The method of claim 9 where the exposed composition layer is developed with an alkaline developer.
Claim 14
Dependent Claim
23 words
The method of claim 13 where the composition layer is developed with an alkaline developer solution that comprises one or more alkaline surfactants.
Claim 15
Dependent Claim
16 words
The method of claim 10 where the exposed composition layer is developed with an acidic developer.
Claim 16
Dependent Claim
23 words
The method of claim 15 where the composition layer is developed with an acidic developer solution that comprises one or more acidic surfactants.
Claim 17
Dependent Claim
16 words
The method of claim 10 where the exposed composition layer is developed with an alkaline developer.
Claim 18
Dependent Claim
23 words
The method of claim 17 where the composition layer is developed with an alkaline developer solution that comprises one or more alkaline surfactants.
Claim 19
Dependent Claim
31 words
The method of claim 9 further comprising permanently altering surface areas bared of the composition upon development, and then removing the remaining composition from the conductive surface with an acidic material.
Claim 20
Dependent Claim
31 words
The method of claim 9 further comprising permanently altering surface areas bared of the composition upon development, and then removing the remaining composition from the conductive surface with an alkaline material.
Claim 21
Dependent Claim
31 words
The method of claim 10 further comprising permanently altering surface areas bared of the composition upon development, and then removing the remaining composition from the conductive surface with an acidic material.
Claim 22
Dependent Claim
31 words
The method of claim 10 further comprising permanently altering surface areas bared of the composition upon development, and then removing the remaining composition from the conductive surface with an alkaline material.