EP0903774A2
Expired / Lapsed
EP
⏱️ 0.0 years remaining
Substrate plating apparatus
Assignee: Ebara Corp
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Filing: 1998-09-17
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Granted: —
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Expires: 2018-09-17
Abstract
Abstract A substrate plating apparatus forms an interconnection layer on an interconnection region composed of a fine groove and/or a fine hole defined in a substrate. The substrate plating apparatus includes a plating unit for forming a plated layer on a surface of the substrate including the interconnection region, a chemical mechanical polishing unit for chemically mechanically polishing the substrate to remove the plated layer from the surface of the substrate leaving a portion of the plated layer in the interconnection region, a cleaning unit for cleaning the substrate after the plated layer is formed or the substrate is chemically mechanically polished, a drying unit for drying the substrate after the substrate is cleaned, and a substrate transfer unit for transferring the substrate to and from each of the first plating unit, the first chemical mechanical polishing unit, the cleaning unit, and the drying unit. The first plating unit, the first chemical mechanical polishing unit, the cleaning unit, the drying unit, and the substrate transfer unit being combined into a single unitary arrangement.
Inventors
- 👤 Akihisa Hongo
- 👤 Naoaki Ogure
- 👤 Hiroaki Inoue
- 👤 Norio Kimura
- 👤 Fumio Kuriyama
- 👤 Manabu Tsujimura
- 👤 Kenichi Suzuki
- 👤 Atsushi Chono
Bibliographic Details
Application Number
—
Jurisdiction
EP
Data Source
google_patents
Last Synchronized
2026-10-28 09:36
CPC Classifications
H; H10; H10P; H10P72/00; H10P72/04; H10P72/0451; H10P72/0452; H10P72/0454; C; C25; C25D; C25D17/00; C25D17/001; H10P14/00; H10P14/40; H10P14/46; H10P14/47; H10P72/0402; H10P72/0406; H10P72/0411; H10P72/0414; H10P72/0456; H10P72/0462; H10P72/0468; H10P72/0472; H10P72/0476; H10W; H10W20/00; H10W20/01; H10W20/031; H10W20/032; H10W20/033; H10W20/037; H10W20/056; H10P72/0441; Y; Y10; Y10S; Y10S134/00; Y10S134/902
Claims Analysis
Total Claims: 10
Claim 1
Independent Claim
166 words
A substrate plating apparatus for forming an
interconnection layer on an interconnection region composed of
a fine groove and/or a fine hole defined in a substrate,
comprising: first plating unit for forming a plated layer on a
surface of the substrate including the interconnection region; first chemical mechanical polishing unit for
chemically mechanically polishing said substrate to remove
unwanted plated layer from the surface of the substrate leaving
a portion of the plated layer in said interconnection region; cleaning unit for cleaning said substrate after said
plated layer is formed or said substrate is chemically
mechanically polished; drying unit for drying said substrate after said
substrate is cleaned; and substrate transfer device for transferring said
substrate to and from each of said first plating unit, said first
chemical mechanical polishing unit, said cleaning unit, and said
drying unit; said first plating unit, said first chemical
mechanical polishing unit, said cleaning unit, said drying unit,
and said substrate transfer device being combined into a single
unitary arrangement.
Claim 2
Dependent Claim
53 words
A substrate plating apparatus according to
claim 1, further comprising: second plating unit for forming a protective plated
layer over said portion of the plated layer in said
interconnection region after unwanted plated layer is removed
from the surface of the substrate, said second plating unit being
contained in said single unitary arrangement.
Claim 3
Dependent Claim
52 words
A substrate plating apparatus according to
claim 1, further comprising: second chemical mechanical polishing unit for
chemically mechanically polishing said substrate to planarize
said protective plated layer formed over said portion of the
plated layer in said interconnection region, said second chemical
mechanical polishing unit being contained in said single unitary
arrangement.
Claim 4
Dependent Claim
36 words
A substrate plating apparatus according to
claim 1, further comprising: discharging facility for discharging a cleaning
solution used by said cleaning unit to clean said substrate, said
discharging facility being contained in said single unitary
arrangement.
Claim 5
Dependent Claim
44 words
A substrate plating apparatus according to
claim 1, wherein said substrate unit device comprises a robot
having an arm, said first plating unit, said first chemical
mechanical polishing unit, said cleaning unit, and said drying
unit being disposed within the reach of said arm.
Claim 6
Dependent Claim
71 words
A substrate plating apparatus according to
claim 1, further comprising: concentration analyzing device for analyzing the
concentrations of components of a plating solution used by said
first plating unit to form said plated layer; and plating solution preparing device for preparing a
plating solution based on the analyzed concentrations from said
concentration analyzing device; said concentration analyzing device and said plating
solution preparing devices being contained in said single unitary
arrangement.
Claim 7
Dependent Claim
132 words
A substrate plating apparatus for plating a
substrate, comprising: a loading and unloading area for transferring a
cassette which stores a substrate; a plating area for plating said substrate; and a cleaning and drying area for cleaning and drying
a plated substrate; said cleaning and drying area being disposed between
said loading and unloading area and said plating area; a first partition disposed between said loading and
unloading area and said cleaning and drying area and having a
passage defined therein for transferring a substrate between said
loading and unloading area and said cleaning and drying area;
and a second partition disposed between said cleaning and
drying area and said plating area and having a passage defined
therein for transferring said substrate between said cleaning
and drying area and said plating area.
Claim 8
Dependent Claim
43 words
A substrate plating apparatus according to
claim 7, further comprising: a first shutter movably mounted for opening and
closing said passage defined in said first partition; and a second shutter movably mounted for opening and
closing said passage defined in said second partition.
Claim 9
Dependent Claim
111 words
A substrate plating apparatus according to
claim 7, which is installed in a clean room, wherein pressures
in said loading and unloading area, said plating area, and said
cleaning and drying area are selected such that the pressure in
said loading and unloading area is higher than the pressure in
said cleaning and drying area which is higher than the pressure
in said plating area, said pressure in said loading and unloading
area being lower than a pressure in said clean room, and/or wherein preferably
a roughly cleaning chamber is positioned
adjacent to said second partition for roughly cleaning said
substrate after plating with gripping hand of said transfer
device therewith.
Claim 10
Dependent Claim
38 words
A substrate plating apparatus for forming an
interconnection layer on a substrate comprising: a plating unit for forming a plated layer on a surface of
the substrate; and a chemical mechanical polishing unit for chemically
polishing said substrate.
References Cited (Backward Citations)
No citation records indexed.
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