Ic package with shield and manufacture thereof

Abstract

Abstract PURPOSE:To simplify a structure of a shield at each IC package by a method wherein a plurality of positions between a low-level conductor layer inside a substrate or a die pad conductor sheet and a shield conductor sheet are bonded by belt-like connection pieces formed collectively by both an upper conductor sheet and a lower conductor sheet. CONSTITUTION:A shield-sheet pattern has connection pieces 12 which are stretched like belts along diagonal lines at four corners of a square conductor sheet 11 which is nearly identical to the surface of an IC package; belt-like patterns at the four corners are bent downward; end parts are folded back inward, are brought into contact with ground wiring parts 15' on a substrate 13 and are bonded at once to a ground layer 14 inside the substrate via through holes 16 during a process to bond leads 3 of an IC package 1 to wiring parts 15. Thereby, the shield sheet 11 can be contacted closely and fixed to the IC package 1 simultaneously. As a result, it is possible to nearly perfectly prevent a radiowave interference from an IC; in addition, it is possible to simplify a structure of a shield at each IC package.

Inventors

• 👤 Yoshiaki Narita
• 👤 成田　芳昭

Bibliographic Details