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JPH0242797A Expired / Lapsed JP ⏱️ 0.0 years remaining

Manufacture of multilayer ceramic wiring board

Assignee: Fujitsu Ltd
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Filing: 1988-08-03
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Granted: —
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Expires: 2008-08-03
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Abstract

Abstract PURPOSE:To form a fine high-density pattern on a green sheet with high quality by a method wherein a pattern made of conductive paste is transferred to the green sheet, then the transfer film is peeled, a plurality of this kind of green sheets are laminated and burned. CONSTITUTION:When a pattern 2 made of conductive paste is printed on a transfer film 1, the surfacer of which is smooth and the whole of which is flexible, it is sufficiently leveled and a high quality pattern 2 is formed. Next, by laminating a green sheet 3 on the transfer film 1 on which the pattern 2 is printed, the pattern 2 is transferred onto the green sheet 3 from the transfer film 1. When the transfer film 1 is peeled, the pattern 2 whose surface is smoothly leveled has been transferred and formed. Since a plurality of this kind of green sheets 3 are laminated, a pattern will not be extended ununiformly even if a pressure is applied. This makes it possible to form high-quality patterns with precision and to obtain multilayer ceramic wiring board having high density and having fine patterns inside it.

Inventors

  • 👤 Shuji Hotta
  • 👤 修二 堀田
  • 👤 Chie Shioda
  • 👤 塩田 千恵

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-10-28 11:49
CPC Classifications
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