Ic package

Abstract

Abstract PURPOSE:To enable high density mounting by arranging the terminal structure such that a second IC package can be mounted in piles on a first IC package installed on a board and be electrically connected to the first IC package and the board. CONSTITUTION:A second IC package 6, which is formed so that proper space may be taken below with the external terminals 2 drawn out long, is mounted in piles on a first IC package 5 installed on a board 7. In case that the IC packages 5 and 6 are piled up, those are mounted with the two projections at the tops of the IC packages 5 fitted into the two recesses 4 at the bottom of the IC package 6, so that area on the board 7 occupied by the IC packages can be reduced to about half, and high density of IC mounting becomes possible.

Inventors

• 👤 Kazuo Aoki
• 👤 一夫 青木

Bibliographic Details