Lead frame

Abstract

Abstract PURPOSE:To reduce a crosstalk noise by locating wirings for ground potential between lead wirings of a lead frame and by connecting them electrically with each other thereby connecting the wirings for ground potential with lead wirings of a lead frame for ground potential electrically. CONSTITUTION:A part where ground potential wirings 6 located between leads 3 are electrically connected with each other is made up of a ground potential wiring for connection 6b which is formed on the back of an insulating film 5 and through holes 7 to connect the ground potential wiring for connection 6b with ground potential wirings 6a located between the lead electrically. The ground potential wirings 6 formed on the insulating film 5 are connected electrically with a ground potential wiring 8 of a lead frame 1 by being connected electrically with the ground potential wirings 8 of the lead frame 1 via the through holes 7. Consequently, both of the potential wirings 6 and 8 can be kept at a ground potential, resulting in the insulation of a ground potential between the lead wirings 3. With a mutual inductance and the mutual capacitance decrease, crosstalk noise becomes small.

Inventors

• 👤 Hiroshi Seki
• 👤 関　博司
• 👤 Haruo Shimamoto
• 👤 晴夫 島本
• 👤 Hideya Yagoura
• 👤 御秡如　英也
• 👤 Yasuhiro Teraoka
• 👤 寺岡　康宏
• 👤 Hiroyuki Tsutsumi
• 👤 堤　浩幸

Bibliographic Details