Lead forming method for semiconductor device

Abstract

Abstract PURPOSE:To improve the flatness of a lead, and stabilize a bending form by performing preliminary bending upward or downward from the root of an outer lead. CONSTITUTION:Leads 12 led out from sealing resin 11 are subjected to preliminary bending from the roots upward or downward, and then final bending shapes are obtained. Thereby the irregularity of outer leads caused by resin contraction in molding process, bur eliminating process, etc., can be corrected. The preliminary bending is desirably performed one or more times upward and downward from the root of the lead. It is more effective for the lead to be returned to a flat state after the preliminary bending of the lead. Thereby the flatness of the lead can be improved, and the bending form can be stabilized.

Inventors

• 👤 Nobuhiro Koyakata
• 👤 古舘　信博
• 👤 Minoru Togashi
• 👤 富樫　実

Bibliographic Details