Metal plating equipment

Abstract

Abstract Translated from Japanese (57)【要約】 【目的】半導体基板の被めっき面における下地金属部に 均一の厚さでめっきを施す。 【構成】半導体基板４をその開口に被せめっき液６を貯 えるカップ１と、このカップ１とめっき液６を供給する 配管７との継手部を施回可能の球体９を保持する軸受１ ０と、陰電極５を回転させる機構と、カップ１の端部を 上昇下降させるシリンダ８ａ，８ｂとを設け、噴出口２ における噴出流によって生ずるめっき液の盛上り部をカ ップ１の揺動で接触させ、半導体基板４を回転させなが らめっき液を被めっき面の全面に一様に接触させる。 (57) [Summary] [Purpose] To perform plating with a uniform thickness on the underlying metal portion on the plated surface of the semiconductor substrate. [Structure] A bearing 1 for holding a sphere 9 capable of turning a cup 1 for covering a semiconductor substrate 4 on its opening and storing a plating solution 6, and a joint portion between the cup 1 and a pipe 7 for supplying the plating solution 6. 0, a mechanism for rotating the negative electrode 5, and cylinders 8a, 8b for raising and lowering the end portion of the cup 1 are provided. The rising portion of the plating solution generated by the jet flow in (1) is brought into contact with the rocking of the cup 1, and the plating solution is brought into uniform contact with the entire surface to be plated while rotating the semiconductor substrate 4.

Inventors

• 👤 Hiroyuki Mori
• 👤 啓之 森

Bibliographic Details