Manufacture of circuit board

Abstract

Abstract Translated from Japanese (57)【要約】 【目的】 本発明は、表面に電気回路や端子等を有する 回路基板、とくに三次元形状に成形された回路基板の製 造方法に関し、成形用の金型の耐久性が高く、生産性の 優れた回路基板の製造方法を提供することを目的とす る。 【構成】 電気回路に対応する畝状の突条３を形成した 基本金型１に熱可塑合成樹脂材を注入して成形加工を施 すことにより、樹脂層８から突条３が露出して成る転写 型９を作成し、この転写型９にメッキ加工を施して突条 ３の頂部３ａに回路導体１０を形成した後、転写型９に 対し再度熱可塑性合成樹脂材を注入する第二次成形加工 を行うことにより、熱可塑性合成樹脂材を一体化すると 共に、回路導体１０を熱可塑性合成樹脂材に転写して回 路基板１５を製造する。 (57) [Abstract] [Object] The present invention relates to a method for manufacturing a circuit board having an electric circuit, terminals, etc. on its surface, particularly a circuit board molded in a three-dimensional shape, and a mold for molding has high durability. An object of the present invention is to provide a method for manufacturing a circuit board having excellent productivity. [Structure] A ridge 3 is exposed from a resin layer 8 by injecting a thermoplastic synthetic resin material into a basic mold 1 in which a ridge-shaped ridge 3 corresponding to an electric circuit is formed and performing a molding process. Secondary molding in which the transfer mold 9 is formed, the transfer conductor 9 is plated, the circuit conductor 10 is formed on the top portion 3a of the ridge 3, and the thermoplastic synthetic resin material is injected into the transfer mold 9 again. By performing the processing, the thermoplastic synthetic resin material is integrated and the circuit conductor 10 is transferred to the thermoplastic synthetic resin material to manufacture the circuit board 15.

Inventors

• 👤 Takeshi Oshima
• 👤 毅 大島

Bibliographic Details