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JPH10247735A Expired / Lapsed JP ⏱️ 0.0 years remaining

Method for manufacturing semiconductor device

Assignee: Semiconductor Energy Laboratory Co Ltd
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Filing: 1997-03-03
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Granted: —
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Expires: 2017-03-03
📄 Original PDF 🌐 Google Patents

Abstract

Abstract Translated from Japanese (57)【要約】 【課題】 珪素の結晶化を助長する触媒を効率的の除去 または低減するための技術を提供する。 【解決手段】 珪素を含む非晶質膜103の上に開口部 105を有した絶縁膜104を形成する。この開口部1 05から触媒元素が導入されて非晶質膜103の結晶化 が行われる。結晶化後、再び絶縁膜104をマスクとし て15族から選ばれた元素を導入し、リン添加領域11 0を形成する。ここが触媒元素のゲッタリングサイトと なるため、触媒元素が除去または低減された横成長領域 111が得られる。 (57) [Problem] To provide a technique for efficiently removing or reducing a catalyst that promotes crystallization of silicon. An insulating film having an opening is formed over an amorphous film containing silicon. This opening 1 The catalyst element is introduced from 05, and the amorphous film 103 is crystallized. After the crystallization, an element selected from Group 15 is introduced again using the insulating film 104 as a mask, and the phosphorus added region 11 is introduced. 0 is formed. Since this becomes a gettering site of the catalytic element, the lateral growth region 111 from which the catalytic element is removed or reduced is obtained.

Inventors

  • 👤 Yoshie Takano
  • 👤 圭恵 高野
  • 👤 Hisashi Otani
  • 👤 久 大谷
  • 👤 Shunpei Yamazaki
  • 👤 舜平 山崎

Bibliographic Details

Application Number —
Jurisdiction JP
Data Source google_patents
Last Synchronized 2026-11-06 14:04
CPC Classifications
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