JPS5230184A
Expired / Lapsed
JP
⏱️ 0.0 years remaining
Semiconductor device
Assignee: Sharp Corp
•
Filing: 1975-09-02
•
Granted: —
•
Expires: 1995-09-02
Abstract
Abstract PURPOSE: To provide a semiconductor device wherein the semiconductor chip has the bumps connected to the extentions of the conductor patterns which are formed on flexible films and are sealed with resins, leaving the chip side without bumps unsealed in order to use the side for contacts. COPYRIGHT: (C)1977,JPO&Japio
Inventors
- 👤 Masao Hayakawa
- 👤 Masao Kumura
- 👤 Takamichi Maeda
Bibliographic Details
Application Number
—
Jurisdiction
JP
Data Source
google_patents
Last Synchronized
2026-10-30 02:22
CPC Classifications
H; H10; H10W; H10W72/00; H10W72/701; H10W74/00
Claims Analysis
Total Claims: 0
No claims parsed yet. Click Sync Now above to re-index claims from Google Patents.
References Cited (Backward Citations)
JPS4933569A
Cited
USPTO Annuity & Maintenance Windows
Maintenance schedule is calculated for granted US utility patents.