Hybrid ic device

Abstract

Abstract PURPOSE:To obtain the hybrid integrated circuit capable of compensating sufficiently an electrical characteristic by a method wherein a thermistor is mounted on a substrate, situated under a semiconductor segment, a heating element, and a temperature of the heating element is accurately conveyed to the thermistor. CONSTITUTION:When electrodes 23 and 25 made a pair are formed on a substrate 24, the electrode 25 on one side is usually situated under the semiconductor segment 21 which is to be mounted on the substrate 24. At this time, however, the electrode 25 is not fitted under the semiconductor segment but formed at an end of the substrate 24 same as the electrode 23. Then, the thermistor 27 is arranged situated between those electrodes 23, 25 and covered with an insulating paste 26 to allow the semiconductor segment 21 to be fixed on the paste. Thereafter, the electrodes formed on the semiconductor segment 21 are connected to the electrodes 23 and 25 respectively using an Al thin wire 22. Thus, the thermistor 27 compensating the temperature is brought close to the semiconductor segment to make the temperature compensation accurate.

Inventors

• 👤 Yoshihiko Sato

Bibliographic Details