Substrate for semiconductor device

Abstract

Abstract PURPOSE:To increase the supporting capability of a lead at a film section by providing a lead-supporting member at the sandwiched section between the hole located at the central part of a flexible insulated film and the hole on the outer circumference. CONSTITUTION:On the film section 1 between the hole 3 provided at the central part of a flexible insulated film and the hole 4 provided at the outer circumference of the hole 3, an insulated supporting member 6 is formed. On the substrate constituted as above, a semiconductor element is connected to the hole 3 section by bonding. At this time, due to the temperature and the load applied to the lead 5, a softening and a subsequent deformation can be given to the film section 1a without difficulty. However, as the film section 1a has been reinformed with the supporting member 6, the bonding can be completed without having a confusion on the arrangement of the lead 5.

Inventors

• 👤 Miyoshi Yoshida

Bibliographic Details