Tape carrier of thermal head and manufacture thereof

Abstract

Abstract PURPOSE:To produce small tape carriers in good yield, by providing a tape carrier, which has been prepared by putting two films one over the other, with a multilayered wiring, and cutting the tape carrier. CONSTITUTION:Conductor lines are formed in position of a first film 17, and a second film 18 formed with device holes 21, 25 and cutting holes 22a-22f, 26a- 26d. An LSI chip is mounted in the hole 21 of the film 17, and is bonded, then the film 18 is laid on the film 17 in position, and after lead terminals of the film 18 are secured to pat parts 28a, 28b of the film 17, the film 18 is cut along cutting lines 27. After the cut film 18 is removed from the film 17, the film 17 is cut along the approximately rectangular lines to obtain the tape carrier 14. Thus, erroneous cutting of the film can be prevented, and therefore the yield of the products can be improved.

Inventors

• 👤 Hideo Abe
• 👤 Osamu Sugano

Bibliographic Details