Semiconductor device

Abstract

Abstract PURPOSE:To prevent the slack and hanging of a wire by mounting a frame body between a semiconductor element and an external electrode. CONSTITUTION:When destances among the semiconductor element 2 and the external electrodes 3 loaded on a substrate 1 are 3.0mm. or longer, the frame body 6 is mounted on the substrate 1 so as to surround the semiconductor element 2, and grooves are formed on an upper surface of the frame body 6 along the connecting directions of the wires. When the height of the groove sections is made higher than the height of the semiconductor element 2 loaded on the substrate 1, the wires pass in the grooves of the frame body 6 from the electrode terminals of the semiconductor element 2, and are connected to the external electrodes. Accordingly, since the slack and hanging of the wires are removed, the wires do not contact mutually, and can be bonded under excellent conditions.

Inventors

• 👤 Takeshi Obata

Bibliographic Details