Semiconductor device

Abstract

Abstract PURPOSE:To enhance the thermal radiation effect, to avoid application of shearing stress to the electrically and mechanically connecting parts of semiconductor elements and a substrate, and to contrive to enhance reliability of the semiconductor device by a method wherein a cap having heat absorbing parts to come in contact with the backs of the semiconductor elements is fixed to the substrate by a fixing tool. CONSTITUTION:The heat absorbing parts 6a of the cap 6 having fins 7 and the backs of the elements 1 are made to come in contact mutually through heat transfer grease 8, one edge of the loop type body 9 of Al foil is welded to the circumferential edge of the cap 6, and a flange 9a at another edge is welded 5 to the metalized layer for sealing of the substrate 2. Loop type or belt type rubber 10 is compressed by a frame 11, and the prescribed pressure is applied between the cap main body 6 and the elements 11. According to this construction, heat transfer to the cap from the elements is favorable, and because the cap is not fixed to the elements, shearing stress according to sliding of the elements 1 is not applied to salient electrodes 4, and because the loop type body 9 also absorbs distortion between the cap 6 and the substrate 2, breakage of the substrate 2 and peeling off of the fixing part with the cap are not generated.

Inventors

• 👤 Masanobu Obara
• 👤 小原　雅信

Bibliographic Details