Sealing of electronic parts

Abstract

Abstract PURPOSE:To contrive miniaturization of a sealing structure as well as to improve the working efficiency by automation by a method wherein the flow of molding resin material is prevented by a frame for printing, and the usage of a frame body as a single-unit part and the adhesion of the frame body are unnecessitated. CONSTITUTION:After a printing frame 5 has been formed in the desired region on the substrate 3, a semiconductor element 1 is installed (die-bonded) at the prescribed position of said frame 5 through the intermediary of solder material 2 to be used for alloy. Then, the terminal electrode of the semiconductor element 1 and a conductor 4 are connected (wire-bonded) by a gold wire 6 in an electrically conductive state. Subsequently, in order to perform a resin sealing on a semiconductor element 1 and a gold wire 6, the prescribed quantity of resin pellet, which was molded into a prescribed form, or a liquid resin material 7 such as epoxy resin and the like, for example, is filled in the frame 5, and the semiconductor element 1 and the gold wire 6 are molded in the buried form. After the molding has been finished, the resin material 7 is hardened by heating at the prescribed temperature for the prescribed hours, 150 deg.C for four hours for example, and the sealing of the semiconductor element 1 is completed.

Inventors

• 👤 Kaoru Shimizu
• 👤 薫 志水

Bibliographic Details