Semiconductor device

Abstract

Abstract PURPOSE:To prevent disconnection of wire between a semiconductor element and a lead to be generated when an integrated circuit device is to be assembled and to be sealed by a method wherein the fixing part by pressure of a bonding wire to connect the semiconductor element and a lead frame is fixed with a covering bump. CONSTITUTION:By fixing the fixing part by pressure of the bonding wire with the covering bump 4, disconnection and strip off of the wire 1 are negated, tensile strength on the whole of wire is enlarged, and DC disconnection fault to be generated between the element and the lead can be eliminated. The bump 4 is formed of an insulator or a metal of comparatively high melting point and having intensity. Accordingly disconnection of wire to be generated between the element and the lead can be eliminated, and DC fault can be reduced.

Inventors

• 👤 Kenichi Tsuchiya
• 👤 憲一 土屋

Bibliographic Details