Preparation of semiconductor device

Abstract

Abstract PURPOSE:To prevent leakage and bending of leads by cutting lead wires under the condition that a part of insulating film is left integratingly as a support of electrode leads of semiconductor chip and by cutting a support between the lead wires after the lead wires are connected to external terminals. CONSTITUTION:A lead wire 4 supported by a support 3 within a hole 2 of an insulating film 1 is extruded and is connected to electrodes of semiconductor chip 5. When a lead wire and an insulating film are cut each other with a support 3 attached, irregular lead wire arrangement does not occur. Wirings 8 of a chip 5 and a printed circuit board 6 are connected to a conductive layer 10 etc. on a ceramic substrate 9, and a support 3 is burned out by irradiating a laser beam spot which is narrower than the interval of lead wires. According to this constitution, there is no leakage current resulting from unwanted support and a highly reliable device can be obtained without any irregular lead wire arrangement during the manufacturing process.

Inventors

• 👤 Kiyoshi Futagawa
• 👤 二川　清

Bibliographic Details