Multilayer interconnection substrate

Abstract

Abstract PURPOSE:To obtain a mounting substrate suitable for an LSI which performs high speed arithmetic operation by a method wherein the following glass powder and the filling conductors are specified, when an insulation layer between conductor wirings is made of the mixture of borosilicate glass powder with alpha- quartz powder, and through holes provided therein are filled with the conductors. CONSTITUTION:After the required through holes 4 are bored by alternately laminating the insulation layers 1 and the conductor wirings 2, which holes are filled with the conductors, connecting pads 3 and input-output pins 7 are provided to the back surface, an IC chip 5 is mounted on the front surface, and the terminals formed in said chip are connected to back surface pads 3 by means of lead wires. In this constitution, the glass powder constituting the insulation layer 1 is SiO2 at 20-60%, B2O2 at 20-40%, Al2O3 at 5-20%, MgO or BaO at 5-25% and Na2O or K2O at 1-4%, and the alpha-quartz powder is prescribed at 33-65% of the total amount of mixture. Besides, the average grain diameter of the filling conductor powder is specified at 0.1-5mum.

Inventors

• 👤 Hiromi Tozaki
• 👤 戸崎　博己
• 👤 Takanobu Noro
• 👤 野呂　孝信
• 👤 Takeshi Fujita
• 👤 毅 藤田
• 👤 Akizo Toda
• 👤 尭三 戸田
• 👤 Akira Ikegami
• 👤 昭 池上
• 👤 Nobuyuki Ushifusa
• 👤 信之 牛房
• 👤 Satoru Ogiwara
• 👤 荻原　覚

Bibliographic Details