Semiconductor device

Abstract

Abstract PURPOSE:To increase the mounting density of a semiconductor element by forming the title device in a constitution in which an element receiving space is shrunk gradually in a stepped manner toward the center in the horizontal direction and toward a bottom section in the height direction. CONSTITUTION:An element receiving space 17 for a ceramic package 12 is shrunk gradually in a stepped manner toward the center in the horizontal direction, and done so toward a bottom section in the height direction, thus forming a cone-shaped recessed section with steps. Element support plates 18', 18'', 18''' are arranged on each step of the element receiving space 17. In this case, linear conductive paths 19', 19'', 19''' are disposed so as to be each brought into contact with a through-hole 14, and connected electrically.

Inventors

• 👤 Teruyuki Nabeta
• 👤 鍋田　照行
• 👤 Kiyoshi Muratake
• 👤 村竹　清

Bibliographic Details