Plastic ic package

Abstract

Abstract PURPOSE:To enable to mount a small-sized IC package in an easy and accurate manner as well as to obtain the IC package which can be handled easily and also can be stacked when wrapped into a bundle for storage and the like. CONSTITUTION:A projected part 4 is protrudingly formed on the mounting side of a plastic part 3 which enveloped an IC chip 1. A recessed part 5 is formed on the surface of the side reverse to the plastic part 3 opposing to the projected part 4. Said recessed part 5 is formed in the size so that it is positioned at a point corresponding to the projected part 4, thereby enabling the projected part 4 of the upper package to engage to the recessed part 5 of the lower IC package when the upper and the lower IC packages are stacked. The projected part 4 is inserted into the positioning hole provided on a substrate in advance, the tip of the projected part 4 is positioned in line with the specific position, a lead 2 is soldered, and the packages are mounted. As a result, the mounting of the miniature IC can be performed in a simple but accurate manner.

Inventors

• 👤 Toshihiko Mori
• 👤 俊彦 森
• 👤 Kenji Kubozono
• 👤 久保薗　健治

Bibliographic Details