Device for forming ball for wire bonder

Abstract

Abstract PURPOSE:To prevent the core slide and oxidation of the titled ball and contrive speed-up by arranging inert gas spouting pipes on both sides of a capillary. CONSTITUTION:The pipes 10 are arranged on both sides of the capillary 3, and an inert gas flows out of the pipes 10 to the tip of the wire 4 for a fixed time while the ball is formed and after it is formed. While the ball is formed, a discharge electrode 1 is moved downward the tip of the wire 4 by a driving means not illustrated, and then moved to a position distant from under the tip of the wire after about 5-10msec discharge. Then, the first bonding is carried out. Thus, since the inert gas is supplied from both sides to the tip of the wire, the core slide of the ball 5 and the intermixture of an oxide can be prevented. Besides, when the electrode 1 moves to just under the wire 4, discharge can be performed immediately, and speed-up is contrived.

Inventors

• 👤 Tomio Kobayashi
• 👤 十三男 小林
• 👤 Motoaki Kadosawa
• 👤 門澤　元昭

Bibliographic Details