Bonding tool for manufacture of semiconductor device

Abstract

Abstract PURPOSE:To improve the bondability while extending the life of bonding tool by a method wherein a ring type groove is provided concentrically with a guide hole guiding a wire on the edge of capillary. CONSTITUTION:A capillary 9 is provided with a guide hole 10 for inserting a wire 6 thereinto while a compression plane 11 rubbing against the wire 6 by vibration is flattened to break down the wire 6 effectively besides the compression plane 11 is provided with a ring type groove 12 concentrically with the guide hole 10. In such a constitution of the capillary 9, the bonding part may be fixed on two points to hold the wire 6 securely by two recessions 12 efficiently transmitting the ultrasonic vibration from the capillary 9 to the wire 6. Resultantly, the ultrasonic output (amplitude) may be reduced to extend the service life of capillary 9.

Inventors

• 👤 Shiro Oba
• 👤 大場　四郎

Bibliographic Details