Plug-in package and manufacture of the same

Abstract

Abstract PURPOSE:To obtain excellent fixing strength and simplify manufacturing processes by a method wherein I/O pins are bonded and fixed to hole-shape fixing parts with a thermosetting conductive adhesive which can be cured at the temperature not higher than 200 deg.C. CONSTITUTION:A process in which I/O pins 7 are fitted in hole-shape supporting parts of a plastic substrate with thermosetting conductive adhesive which can be cured at the temperature not higher than 200 deg.C and a process in which the substrate is heated at the temperature in the range of not higher than 200 deg.C to cure the adhesive and fix the I/O pins 7 in the hole-shape supporting parts. If the curing temperature of thermosetting conductive adhesive is higher than 200 deg.C, as the substrate is exposed to the temperature higher than 200 deg.C when the I/O pins 7 are fixed, the plastic substrate 3 tends to develope deformation or the like by heating. The volume resistivity of the adhesive is preferably not higher than 1X10<3>OMEGA.cm. As thermosetting resin itself is close to insulating material, the resistance value can be controlled by mixing conductive fillers.

Inventors

• 👤 Hirobumi Kinoshita
• 👤 博文 木下
• 👤 Koichiro Nomoto
• 👤 野元　浩一郎

Bibliographic Details